Noncontact electrical test of a ball grid array substrate that uses the electro-optic probing technique.
A new technique for testing a ball grid array (BGA) package substrate that uses the electro-optic (EO) probing technique is investigated. This technique can detect open circuits in the BGA substrate with a high spatial resolution. An experimental setup that uses an EO probe tip made of LiNbO3 crystal is reported along with the measurement results from a real BGA substrate.
Kuo
Wen-Kai
WK
Department of Electro-Optics Engineering, National Huwei University of Science and Technology, 64 Wenhua Road, Huwei, Yunlin 63208, Taiwan. wkkuo@nhust.edu.tw
Tang
Deng-Tzung
DT
Wu
Chien-Jang
CJ
Lai
Thomson
T