Oxidation behaviors of metallic copper particles in NO reduction mechanism of copper/activated carbons.
The reduction of nitric oxide (NO) over Cu/ACFs, prepared by copper electroplating, has been studied. It is found that copper content on the ACFs increases with increasing plating time (up to 45 wt%), while the textural properties including specific surface areas and total pore volumes decrease. As an experimental result, the NO reduction efficiency is increased in all of the Cu/ACFs, and it is confirmed that NO is converted into nitrogen and oxygen on the Cu/ACF surfaces (at 500 degrees C). Especially, the Cu metals on the ACF surfaces scavenge oxygen by oxidizing themselves into Cu2O and finally CuO as a reductant. It is indicated that copper metals on the Cu/ACFs play a major role in the NO removal in this system.
Park
Soo-Jin
SJ
Advanced Materials Division, Korea Research Institute of Chemical Technology, P.O. Box 107, Yusong, Daejeon 305-600, South Korea. psjin@krict.re.kr
Kim
Byung-Joo
BJ
D002244:Carbon / Q000737:chemistry*; D003300:Copper / Q000737:chemistry*; D009569:Nitric Oxide / Q000737:chemistry*; D009584:Nitrogen / Q000737:chemistry; D010084:Oxidation-Reduction; D010100:Oxygen / Q000737:chemistry; D010316:Particle Size; D013499:Surface Properties; D013997:Time Factors; D014961:X-Ray Diffraction
D009569:Nitric Oxide; D002244:Carbon; D003300:Copper; D009584:Nitrogen; D010100:Oxygen