title: Noncontact electrical test of a ball grid array substrate that uses the electro-optic probing technique.
abstract: A new technique for testing a ball grid array (BGA) package substrate that uses the electro-optic (EO) probing technique is investigated. This technique can detect open circuits in the BGA substrate with a high spatial resolution. An experimental setup that uses an EO probe tip made of LiNbO3 crystal is reported along with the measurement results from a real BGA substrate.
authors.affiliation: Department of Electro-Optics Engineering, National Huwei University of Science and Technology, 64 Wenhua Road, Huwei, Yunlin 63208, Taiwan. wkkuo@nhust.edu.tw
authors.forename: Wen-Kai
authors.initials: WK
authors.lastname: Kuo
authors.forename: Deng-Tzung
authors.initials: DT
authors.lastname: Tang
authors.forename: Chien-Jang
authors.initials: CJ
authors.lastname: Wu
authors.forename: Thomson
authors.initials: T
authors.lastname: Lai