Effect of background electrolytes and pH on the adsorption of Cu(II)/EDTA onto TiO2.
Cu(II)/EDTA adsorption onto TiO2 has been studied with a variation of pH, ionic strength, and type of background electrolytes. Cu(II) adsorption onto TiO2 increased as ionic strength increased when NaClO4 was used as a background electrolyte. This can be explained by the increase of exp(-FPsi/RT) as a part of the electrostatic correction within a surface complexation model. Model predictions described experimental adsorption trends. Types of background anions (ClO4, Cl, NO2, NO3, SO3, and PO4) did not affect adsorption trends and adsorption amounts of Cu(II) onto TiO2. However, different trends were observed with various types of background ions used as ionic strength in EDTA and Cu(II)-EDTA adsorption. EDTA adsorption was decreased by using Na2SO3 and Na3PO4 as background ions, while NaClO4, NaCl, NaNO2, and NaNO3 showed negligible interference on the EDTA adsorption, which matched well with model predictions. The presence Na2SO3 and Na3PO4 also interfered with Cu(II)-EDTA adsorption, to a somewhat greater extent compared to EDTA adsorption, especially at lower pH. This interference was also noted in Cu(II)-EDTA adsorption with a variation of Cu(II)-EDTA concentration at constant ionic strength (3 x 10(-3) M) by using Na2SO3 and Na3PO4, especially at lower ratios of Cu(II)-EDTA to Na2SO3 and Na3PO4. These results suggest that the ratio of Cu(II)-EDTA to Na2SO3 and Na3PO4 is an important factor for the controlling of competition between these background ions and Cu(II)-EDTA onto TiO2. Model prediction generally matched well with experimental adsorption using NaClO4, NaCl, NaNO2, and NaNO3 as backgrounds ions, while a severe deviation was observed in the presence of Na2SO3 and Na3PO4. These results suggest that the mobility of copper ions as Cu(II)-EDTA can be increased from polluted area in the presence of multivalent background ions, especially as the ratio of adsorbates/background ions decreased.
Yang
Jae-Kyu
JK
School of Civil and Environmental Engineering, Kwandong University, Yangyang 215-802, Republic of Korea.
Lee
Seung-Mok
SM
Davis
Allen P
AP