title: Additive soft-lithographic patterning of submicrometer- and nanometer-scale large-area resists on electronic materials.
abstract: We describe a novel soft-lithographic technique possessing broad utility for the fabrication of large area, nanoscale ( approximately 100 nm) multilayer resist structures on electronic material substrates. This additive patterning method transfers ultrathin poly(dimethylsiloxane) (PDMS) decals to an underlying SiO(2)-capped organic planarazation layer. The PDMS patterns serve as a latent image through which high-quality multilayer resist structures can be developed using reactive ion-beam etching.
authors.affiliation: Department of Chemistry, Beckman Institute and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
authors.forename: Heejoon
authors.initials: H
authors.lastname: Ahn
authors.forename: Keon Jae
authors.initials: KJ
authors.lastname: Lee
authors.forename: Anne
authors.initials: A
authors.lastname: Shim
authors.forename: John A
authors.initials: JA
authors.lastname: Rogers
authors.forename: Ralph G
authors.initials: RG
authors.lastname: Nuzzo
mesh_terms: D003460:Crystallization / Q000379:methods*; D004129:Dimethylpolysiloxanes / Q000737:chemistry*; D004581:Electronics; D008567:Membranes, Artificial; D008904:Miniaturization / Q000379:methods; D049329:Nanostructures / Q000737:chemistry* / Q000648:ultrastructure*; D036103:Nanotechnology / Q000379:methods; D010316:Particle Size; D010781:Photography / Q000379:methods*; D012822:Silicon Dioxide / Q000737:chemistry*; D012828:Silicones / Q000737:chemistry*; D013499:Surface Properties
chemical_list: D004129:Dimethylpolysiloxanes; D008567:Membranes, Artificial; D012828:Silicones; C013830:baysilon; D012822:Silicon Dioxide