A simple etching technique for improving the retention of fiber posts to resin composites.
Coupling of fiber posts to composites is hampered by absence of chemical union between epoxy resins and methacrylate-based resins. This study examined a clinically feasible protocol for creating micromechanical retention on the surface of fiber posts, using hydrogen peroxide etching to remove the surface layer of epoxy resin. This was followed by silanization of the exposed quartz fibers to enhance their chemical bonding to composites. Etching with 24% H2O2 for 10 min or 10% H2O2 for 20 min produced a 50 microm thick surface zone that is depleted of epoxy resin, leaving intact, undamaged quartz fibers for silanization. Low viscosity flowable composites were employed to infiltrate this zone, to simulate the creation of hybrid layers in acid-etched dentin by dentin adhesives. Interfacial strengths were enhanced with the adjunctive use of H2O2 etching and silanization, and were probably dependent on the ability of the flowable composites to completely infiltrate this interdiffusion zone.
Monticelli
Francesca
F
Department of Restorative Dentistry and Dental Materials, Policlinico Le Scotte, University of Siena, Viale Bracci, 53100 Siena, Italy. montecelli@unisi.it
Toledano
Manuel
M
Tay
Franklin R
FR
Sadek
Fernanda T
FT
Goracci
Cecilia
C
Ferrari
Marco
M
D017609:Barium Compounds; D017438:Bisphenol A-Glycidyl Methacrylate; D003188:Composite Resins; D001840:Dental Bonding; D045662:Dental Etching / Q000379:methods*; D003799:Dental Stress Analysis; D004853:Epoxy Resins; D006861:Hydrogen Peroxide; D008422:Materials Testing; D008855:Microscopy, Electron, Scanning; D011176:Post and Core Technique; D011791:Quartz; D019279:Resin Cements; D012821:Silanes; D012822:Silicon Dioxide; D013499:Surface Properties; D013718:Tensile Strength
C121035:Aeliteflo; D017609:Barium Compounds; D003188:Composite Resins; D004853:Epoxy Resins; D019279:Resin Cements; D012821:Silanes; C510179:UniFil Flow; D011791:Quartz; D017438:Bisphenol A-Glycidyl Methacrylate; D012822:Silicon Dioxide; D006861:Hydrogen Peroxide