title: Well-aligned open-ended carbon nanotube architectures: an approach for device assembly.
abstract: To circumvent the high carbon nanotube (CNT) growth temperature and poor adhesion with the substrates that currently plague CNT implementation, we proposed using CNT transfer technology enabled by open-ended CNTs. The process is featured with separation of CNT growth and CNT device assembly. Field emission testing of the as-assembled CNT devices is in good agreement with the Fowler-Nordheim (FN) equation, with a field enhancement factor of 4,540. This novel technique shows promising applications for positioning CNTs on temperature-sensitive substrates and for the fabrication of field emitters, electrical interconnects, and thermal management structures in microelectronics packaging.
authors.affiliation: School of Chemical & Biomolecular Engineering, Georgia Institute of Technology, 311 Ferst Drive, Atlanta, Georgia 30332, USA.
authors.forename: Lingbo
authors.initials: L
authors.lastname: Zhu
authors.forename: Yangyang
authors.initials: Y
authors.lastname: Sun
authors.forename: Dennis W
authors.initials: DW
authors.lastname: Hess
authors.forename: Ching-Ping
authors.initials: CP
authors.lastname: Wong
mesh_terms: D000327:Adsorption; D007854:Lead / Q000737:chemistry; D008855:Microscopy, Electron, Scanning / Q000379:methods; D037742:Nanotubes, Carbon / Q000737:chemistry*; D010316:Particle Size; D012680:Sensitivity and Specificity; D012825:Silicon / Q000737:chemistry; D013499:Surface Properties; D013696:Temperature; D014001:Tin / Q000737:chemistry
chemical_list: D037742:Nanotubes, Carbon; D007854:Lead; D014001:Tin; D012825:Silicon