title: Solid-state bonding technique for template-stripped ultraflat gold substrates.
abstract: A simple procedure using gold diffusion bonding for the preparation of template-stripped gold (TSG) surfaces is described. TSG surfaces are useful for surface studies because a very consistent flat gold surface with few defects can be easily prepared. We have developed a method of producing TSG surfaces that relies only on gold diffusion bonding rather than epoxies. The resulting substrates are free from concerns of solvent compatibility, heat stability, and impurities. Bonding of centimeter-sized substrates is performed at 300 degrees C for 2 h using a vise and aluminum foil.
authors.affiliation: Center for Bits and Atoms, Massachusetts Institute of Technology, Building E15-433, 20 Ames Street, Cambridge, Massachusetts 02139, USA.
authors.forename: David W
authors.initials: DW
authors.lastname: Mosley
authors.forename: Brian Y
authors.initials: BY
authors.lastname: Chow
authors.forename: Joseph M
authors.initials: JM
authors.lastname: Jacobson