Plasma-based processes for surface wettability modification.
In this article, we describe a method to create rough features on silicon surfaces by reactive etching of a photoresist layer. The roughness and, consequently, the wettability of the surfaces can be modified by modifying the duration of plasma etching. Hydrophobic materials deposited on the rough silicon surface can be modified until a superhydrophobic behavior is obtained, whereas hydrophilic materials become more hydrophilic. The elaboration technique described herein offers an inexpensive and rapid method for the creation of tunable roughness on silicon surfaces with large areas.
Lejeune
Michaël
M
European Commission, Joint Research Centre, Institute for Health and Consumer Protection, I-21020 Ispra (VA), Italy.
Lacroix
Lise Marie
LM
Brétagnol
Frédéric
F
Valsesia
Andrea
A
Colpo
Pascal
P
Rossi
François
F
D057927:Hydrophobic and Hydrophilic Interactions; D012825:Silicon / Q000737:chemistry*; D017155:Wettability
D012825:Silicon