Plasma-based processes for surface wettability modification.
In this article, we describe a method to create rough features on silicon surfaces by reactive etching of a photoresist layer. The roughness and, consequently, the wettability of the surfaces can be modified by modifying the duration of plasma etching. Hydrophobic materials deposited on the rough silicon surface can be modified until a superhydrophobic behavior is obtained, whereas hydrophilic materials become more hydrophilic. The elaboration technique described herein offers an inexpensive and rapid method for the creation of tunable roughness on silicon surfaces with large areas.
European Commission, Joint Research Centre, Institute for Health and Consumer Protection, I-21020 Ispra (VA), Italy.
Michaël
M
Lejeune
Lise Marie
LM
Lacroix
Frédéric
F
Brétagnol
Andrea
A
Valsesia
Pascal
P
Colpo
François
F
Rossi
D057927:Hydrophobic and Hydrophilic Interactions; D012825:Silicon / Q000737:chemistry*; D017155:Wettability
D012825:Silicon