Reliable fabrication method of transferable micron scale metal pattern for poly(dimethylsiloxane) metallization.
We have developed a reliable fabrication method of forming micron scale metal patterns on poly(dimethylsiloxane) (PDMS) using a pattern transfer process. A metal stack layer consisting of Au-Ti-Au layers, providing a weak but reliable adhesion, was deposited on a silicon wafer. The metal stack layer was then transferred to a PDMS substrate using serial and selective etching. We demonstrate that features as small as 2 microm were reliably transferred on to the PDMS substrate for use as interconnects and electrodes for biosensors and flexible electronics application.
Lim
Kwan Seop
KS
Birck Nanotechnology Center and Bindley Bioscience Center, School of Electrical and Computer Engineering, Weldon School of Biomedical Engineering, Purdue University, West Lafayette, USA.
Chang
Woo-Jin
WJ
Koo
Yoon-Mo
YM
Bashir
Rashid
R
D004129:Dimethylpolysiloxanes / Q000737:chemistry*; D006046:Gold / Q000737:chemistry*; D012825:Silicon / Q000737:chemistry; D012828:Silicones / Q000737:chemistry*; D014025:Titanium / Q000737:chemistry*
D004129:Dimethylpolysiloxanes; D012828:Silicones; C013830:baysilon; D006046:Gold; D014025:Titanium; D012825:Silicon