title: Polymerization kinetics and mechanical characterization of new formulations of light-cured dental sealants.
abstract: The aim of the study was to develop and evaluate the in vitro performance of a new and simplified formulation of photocuring resin to be used as dental sealant. Two experimental dental sealants (CYTED1 and CYTED2) were formulated and their kinetic of polymerisation and physico-chemical properties were studied and compared to those of two commercially available sealants (Helioseal, Delton-FS). Rates of photoinitiated polymerisation (Rp), as well as the conversions and the quantum yields of polymerisation (phi(p)) were calculated. Flexural strength, Young's modulus, microhardness, microleakage, water sorption, and solubility were also tested. ANOVA, Student-Newman-Keuls, Pearson correlation and Kruskal-Wallis tests were used (p < 0.05). The highest Rp and phi(p) were obtained for the sealant CYTED2, Rp and phi(p) were similar for CYTEDl and Helioseal, and the lowest for Delton. Water sorption values were similar for Helioseal and CYTED2 being higher for CYTED1 and lower for Delton. No differences were found for solubility and microleakage values. Mechanical properties were better for Delton and no differences were found within the rest of the sealants. At short irradiation times (30 s), the maximum effectiveness of the photoinitiating system was obtained by the experimental CYTED2.
authors.affiliation: Department of Dental Materials. Dental School, University of Granada, Spain.
authors.forename: Estrella
authors.initials: E
authors.lastname: Osorio
authors.forename: Raquel
authors.initials: R
authors.lastname: Osorio
authors.forename: Natalia
authors.initials: N
authors.lastname: Davidenko
authors.forename: Roberto
authors.initials: R
authors.lastname: Sastre
authors.forename: Jose A
authors.initials: JA
authors.lastname: Aguilar
authors.forename: Manuel
authors.initials: M
authors.lastname: Toledano
mesh_terms: D003799:Dental Stress Analysis; D007700:Kinetics; D008422:Materials Testing; D010777:Photochemistry; D010895:Pit and Fissure Sealants / Q000737:chemistry*
chemical_list: D010895:Pit and Fissure Sealants