title: Inorganic immersion fluids for ultrahigh numerical aperture 193 nm lithography.
abstract: Immersion lithography has become attractive since it can reduce critical dimensions by increasing numerical aperture (NA) beyond unity. Among all the candidates for immersion fluids, those with higher refractive indices and low absorbance are desired. Characterization of the refractive indices and absorbance of various inorganic fluid candidates has been performed. To measure the refractive indices of these fluids, a prism deviation angle method was developed. Several candidates have been identified for 193 nm application with refractive indices near 1.55, which is approximately 0.1 higher than that of water at this wavelength. Cauchy parameters of these fluids were generated and approaches were investigated to tailor the fluid absorption edges to be close to 193 nm. The effects of these fluids on photoresist performance were also examined with 193 nm immersion lithography exposure at various NAs. Half-pitch 32 nm lines were obtained with phosphoric acid as the immersion medium at 1.5 NA. These fluids are potential candidates for immersion lithography technology.
authors.affiliation: Microelectronic Engineering Department, Rochester Institute of Technology, New York 14623, USA. jaz0485@rit.edu
authors.forename: Jianming
authors.initials: J
authors.lastname: Zhou
authors.forename: Yongfa
authors.initials: Y
authors.lastname: Fan
authors.forename: Anatoly
authors.initials: A
authors.lastname: Bourov
authors.forename: Bruce W
authors.initials: BW
authors.lastname: Smith