title: Electric device improves bonds of simplified etch-and-rinse adhesives.
abstract: OBJECTIVE
  This study investigated the effects of an electric field produced by a new device for the application of etch-and-rinse adhesives on demineralized dentin surfaces.
  
  
  METHODS
  Three simplified etch-and-rinse adhesives (Single Bond, Prime&Bond NT and One-Step) were applied with the electric device and compared with controls prepared with disposable sponges. Specimens were processed for microtensile bond strength test and nanoleakage investigation using high resolution SEM.
  
  
  RESULTS
  Microtensile testing revealed higher bond strengths (p<0.05) for all adhesives tested when electricity was used. Adhesive interfaces prepared with electric impulses exhibited very homogenous hybrid layers with minimal nanoleakage compared with the controls.
  
  
  CONCLUSIONS
  The use of electricity produced by a new electronic device during the application of dentin adhesives may increase adhesive adaptation to the dentin substrate and improve dentin hybridization due to the substrate modifications induced by an electric field on the demineralized dentin organic matrix.
authors: Department of Dental Sciences, University of Tor Vergata, Rome, Italy.
authors: Guido
authors: G
authors: Pasquantonio
authors: Franklin R
authors: FR
authors: Tay
authors: Annalisa
authors: A
authors: Mazzoni
authors: Pietro
authors: P
authors: Suppa
authors: Alessandra
authors: A
authors: Ruggeri
authors: Mirella
authors: M
authors: Falconi
authors: Roberto
authors: R
authors: Di Lenarda
authors: Lorenzo
authors: L
authors: Breschi