title: Modeling on debonding dynamics of pressure-sensitive adhesives.
abstract: We propose a simple mechanical model describing viscoelasticity and cavitation during the debonding process in pressure-sensitive adhesives (PSA). Our calculation qualitatively reproduces typical stress-strain curves in the probe-tack test, such as the steep stress maxima and the following plateau region. It is shown that in the thin-film geometry the stress-strain curve is essentially determined by the cavities created by the large negative pressure. Effects of pre-existent air bubbles due to surface roughness are also discussed.
authors.affiliation: CREST, Japan Science and Technology Agency, Japan. yamaguchi@rheo.t.u-tokyo.ac.jp
authors.forename: T
authors.initials: T
authors.lastname: Yamaguchi
authors.forename: H
authors.initials: H
authors.lastname: Morita
authors.forename: M
authors.initials: M
authors.lastname: Doi
mesh_terms: D000268:Adhesiveness; D000269:Adhesives / Q000032:analysis / Q000737:chemistry*; D003198:Computer Simulation; D004548:Elasticity; D006244:Hardness; D008422:Materials Testing; D008433:Mathematics; D008956:Models, Chemical; D013314:Stress, Mechanical; D013718:Tensile Strength; D014783:Viscosity
chemical_list: D000269:Adhesives