title: The microtensile bond strength of self-etching adhesives to ground enamel.
abstract: It is uncertain whether single-phase self-etching adhesives form bonds to enamel as reliable as those of etch-and-rinse adhesives. This study compared the microtensile bond strengths to ground enamel of three self-etching adhesive systems, a self-etching primer system and an etchand-rinse adhesive system. Human enamel was ground flat with 320-grit silicone carbide paper. The self-etching adhesives iBond (Heraeus Kulzer), Prompt L-Pop (3M ESPE) and Xeno III (Caulk/Dentsply), the adhesive with a self-etching primer Clearfil SE Bond (Kuraray) and the etch-and-rinse adhesive Scotchbond Multipur-pose (3M/ESPE) were applied as directed, followed by a core of the same manufacturers' hybrid resin composite. A microtensile bond strength evaluation was performed after 48 hours of water storage, using untrimmed beams approximately 0.9 mm2 in cross-sectional area at a crosshead speed of 0.6 mm/minute. There were no pretest failures in any group, and failures were predominately adhesive or mixed. Adhesion to enamel of Clearfil SE was not significantly different from Scotchbond Multi-Purpose, while the three self-etching adhesive systems demonstrated significantly lower bond strengths (One-way ANOVA, Tukey-Kramer Multiple-Comparison Test, p < 0.00001).
authors.affiliation: Department of Oral Rehabilitation, School of Dentistry, Medical College of Georgia, Augusta, GA, USA. wbrackett@mail.mcg.edu
authors.forename: William W
authors.initials: WW
authors.lastname: Brackett
authors.forename: Shuichi
authors.initials: S
authors.lastname: Ito
authors.forename: Yoshihiro
authors.initials: Y
authors.lastname: Nishitani
authors.forename: Larry D
authors.initials: LD
authors.lastname: Haisch
authors.forename: David H
authors.initials: DH
authors.lastname: Pashley
mesh_terms: D000134:Acid Etching, Dental / Q000379:methods; D000268:Adhesiveness; D017554:Carbon Compounds, Inorganic / Q000737:chemistry; D003188:Composite Resins / Q000737:chemistry; D001840:Dental Bonding; D003743:Dental Enamel / Q000648:ultrastructure*; D003764:Dental Materials / Q000737:chemistry; D017220:Dentin-Bonding Agents / Q000737:chemistry; D006801:Humans; D008422:Materials Testing; D019279:Resin Cements / Q000737:chemistry*; D017655:Silicon Compounds / Q000737:chemistry; D013314:Stress, Mechanical; D013499:Surface Properties; D013718:Tensile Strength; D019246:Tooth Preparation / Q000379:methods; D014867:Water / Q000737:chemistry
chemical_list: D017554:Carbon Compounds, Inorganic; C438313:Clearfil SE Bond; D003188:Composite Resins; D003764:Dental Materials; D017220:Dentin-Bonding Agents; C408584:Prompt L-Pop; D019279:Resin Cements; C084018:Scotchbond Multi-Purpose; D017655:Silicon Compounds; C487957:Xeno III; C477386:iBond; D014867:Water; C022088:silicon carbide