High fidelity, high yield production of microfluidic devices by hot embossing lithography: rheology and stiction.
We discuss thermoforming of thermoplastic polymers for the hot-embossing lithographic (HEL) fabrication of microfluidic chips near equilibrium conditions that minimize elastic recoil for optimal motif replication. While HEL is often simplistically described as the transfer of micro- and nano-motifs into heat-softened thermoplastic materials, we describe our rational approach to selecting appropriate processing parameters.
Cameron
Neil S
NS
Industrial Materials Institute: National Research Council Canada, 75 Blvd. De Mortagne, Boucherville, Québec, J4B 6Y4, Canada. neil.cameron@cnrc.gc.ca
Roberge
Helene
H
Veres
Teodor
T
Jakeway
Stephen C
SC
John Crabtree
H
H