title: High fidelity, high yield production of microfluidic devices by hot embossing lithography: rheology and stiction.
abstract: We discuss thermoforming of thermoplastic polymers for the hot-embossing lithographic (HEL) fabrication of microfluidic chips near equilibrium conditions that minimize elastic recoil for optimal motif replication. While HEL is often simplistically described as the transfer of micro- and nano-motifs into heat-softened thermoplastic materials, we describe our rational approach to selecting appropriate processing parameters.
authors.affiliation: Industrial Materials Institute: National Research Council Canada, 75 Blvd. De Mortagne, Boucherville, Québec, J4B 6Y4, Canada. neil.cameron@cnrc.gc.ca
authors.forename: Neil S
authors.initials: NS
authors.lastname: Cameron
authors.forename: Helene
authors.initials: H
authors.lastname: Roberge
authors.forename: Teodor
authors.initials: T
authors.lastname: Veres
authors.forename: Stephen C
authors.initials: SC
authors.lastname: Jakeway
authors.forename: H
authors.initials: H
authors.lastname: John Crabtree