[Study on the compositions in the interface of corrosion inhibition membrane/copper plating layer/iron substrate by depth etching and photoelectron spectroscopy].
In order to explore the reason for the weak bond intensity between pyro-phosphate copper plating layer and iron substrate, spectrum technology was adopted. The compositions of various elements in the perpendicular interface were analyzed. The effect of surface roughness in the metal substrate on various elements distribution was discussed. According to etching time, the membrane layer was divided into three portions: surface layer with nitrogen and oxygen content decreasing quickly, mesosphere of basic fixed composition, and mix disturbing layer with substrate element appearing and occupying a half thickness. Through analyzing oxygen content in the mix layer, it was concluded that the oxygen layer in the interface of copper layer/iron substrate was the main cause of influencing the bond intensity between the plating layer and substrate.
Feng
Shao-bin
SB
Zhengzhou Institute of Light Industry, Zhengzhou 450002, China.
Shang
Shi-bo
SB
Feng
Li-ting
LT
Liu
Qing
Q
Zhang
Jing-wei
JW
Li
Zong-hui
ZH