title: Interdiffusion of Al-Ni system enhanced by ultrasonic vibration at ambient temperature.
abstract: At ambient temperature, Al-1%Si wire of 25 microm diameter was bonded successfully onto the Au/Ni/Cu pad by ultrasonic wedge bonding technology. Physical process of the bond formation and the interface joining essence were investigated. It is found that the wire was softened by ultrasonic vibration, at the same time, pressure was loaded on the wire and plastic flow was generated in the bonding wire, which promoted the diffusion for Ni into Al. Ultrasonic vibration enhanced the interdiffusion that resulted from the inner defects such as dislocations, vacancies, voids and so on, which ascribed to short circuit diffusion.
authors.affiliation: Harbin Institute of Technology Shenzhen Graduate School, HIT Campus, Shenzhen University Town, Xili, Shenzhen, PR China. myli@hit.edu.cn <myli@hit.edu.cn>
authors.forename: Mingyu
authors.initials: M
authors.lastname: Li
authors.forename: Hongjun
authors.initials: H
authors.lastname: Ji
authors.forename: Chunqing
authors.initials: C
authors.lastname: Wang
authors.forename: Han Sur
authors.initials: HS
authors.lastname: Bang
authors.forename: Hee Seon
authors.initials: HS
authors.lastname: Bang
mesh_terms: D000535:Aluminum / Q000737:chemistry* / Q000528:radiation effects; D004058:Diffusion / Q000528:radiation effects; D008669:Metallurgy / Q000379:methods*; D009532:Nickel / Q000737:chemistry* / Q000528:radiation effects; D013010:Sonication; D013696:Temperature; D014732:Vibration
chemical_list: D009532:Nickel; D000535:Aluminum