Multiscale free-space optical interconnects for intrachip global communication: motivation, analysis, and experimental validation.
The use of optical interconnects for communication between points on a microchip is motivated by system-level interconnect modeling showing the saturation of metal wire capacity at the global layer. Free-space optical solutions are analyzed for intrachip communication at the global layer. A multiscale solution comprising microlenses, etched compound slope microprisms, and a curved mirror is shown to outperform a single-scale alternative. Microprisms are designed and fabricated and inserted into an optical setup apparatus to experimentally validate the concept. The multiscale free-space system is shown to have the potential to provide the bandwidth density and configuration flexibility required for global communication in future generations of microchips.
McFadden
Michael J
MJ
Department of Electrical and Computer Engineering, University of Delaware, Newark 19711, USA. michael.j.mcfadden@aero.org
Iqbal
Muzammil
M
Dillon
Thomas
T
Nair
Rohit
R
Gu
Tian
T
Prather
Dennis W
DW
Haney
Michael W
MW