Application of saccharose as copper(II) ligand for electroless copper plating solutions.
Saccharose, forming sufficiently stable complexes with copper(II) ions in alkaline solutions, was found to be a suitable ligand for copper(II) chelating in alkaline (pH>12) electroless copper deposition solutions. Reduction of copper(II)-saccharose complexes by hydrated formaldehyde was investigated and the copper deposits formed were characterized. The thickness of the compact copper coatings obtained under optimal operating conditions in 1h reaches ca. 2 microm at ambient temperature. The plating solutions were stable and no signs of Cu(II) reduction in the bulk solution were observed. Results were compared with those systems operating with other copper(II) ligands.
Norkus
Eugenijus
E
Department of Catalysis, Institute of Chemistry, A. Gostauto 9, LT-01108 Vilnius, Lithuania. norkus@ktl.mii.lt <norkus@ktl.mii.lt>
Prusinskas
Kestutis
K
Vaskelis
Algirdas
A
Jaciauskiene
Jane
J
Stalnioniene
Irena
I
Macalady
Donald L
DL
D002614:Chelating Agents; D003300:Copper / Q000737:chemistry / Q000378:metabolism*; D004595:Electroplating; D008024:Ligands; D015394:Molecular Structure; D012996:Solutions; D013395:Sucrose / Q000737:chemistry / Q000378:metabolism*
D002614:Chelating Agents; D008024:Ligands; D012996:Solutions; D013395:Sucrose; D003300:Copper