Electric-current-assisted application of self-etch adhesives to dentin.
The use of electric current during the application of etch-and-rinse adhesive systems has been recently claimed to increase bonding of etch-and-rinse adhesives by enhancing substrate impregnation. The null hypothesis tested in this study was that electrically assisted application has no effect on bond strength of self-etching bonding systems. Three self-etch adhesives (Protect-Bond, Xeno III, and Prompt L-Pop) were applied with the aid of an electric signal-generating device (ElectroBond) and tested vs. controls prepared with the same disposable sponges but without electric current. Specimens bonded under the influence of electric current exhibited increased microtensile bond strength compared with the controls (p<0.05). High-resolution SEM analysis showed that bonding under the influence of electricity reduced interfacial nanoleakage. It is speculated that resin infiltration may be improved by the attraction of polar monomers by an electric current or by modification of the dentin surface charges, resulting in better water substitution or evaporation.
Breschi
L
L
Division of Dental Sciences and Biomaterials, Department of Biomedicine, University of Trieste, Via Stuparich, 1, I-34125 Trieste, Italy. lbreschi@units.it
Mazzoni
A
A
Pashley
D H
DH
Pasquantonio
G
G
Ruggeri
A
A
Suppa
P
P
Mazzotti
G
G
Di Lenarda
R
R
Tay
F R
FR
D000641:Ammonia; D001840:Dental Bonding / Q000379:methods; D003763:Dental Leakage / Q000145:classification / Q000517:prevention & control; D003804:Dentin / Q000648:ultrastructure*; D017220:Dentin-Bonding Agents / Q000737:chemistry*; D004577:Electron Probe Microanalysis; D006801:Humans; D007478:Iontophoresis / Q000295:instrumentation / Q000379:methods*; D008422:Materials Testing; D008855:Microscopy, Electron, Scanning; D019279:Resin Cements / Q000737:chemistry; D018030:Silver Compounds; D016622:Silver Staining; D016037:Single-Blind Method; D013499:Surface Properties; D013718:Tensile Strength
C503075:Clearfil Protect Bond; D017220:Dentin-Bonding Agents; C408584:Prompt L-Pop; D019279:Resin Cements; D018030:Silver Compounds; C487957:Xeno III; C077954:silver diammine; D000641:Ammonia