Reflow and electrical characteristics of nanoscale solder.
Gu
Zhiyong
Z
Department of Chemical and Biomolecular Engineering, Johns Hopkins University, Baltimore, MD 21218, USA.
Ye
Hongke
H
Smirnova
Diana
D
Small
David
D
Gracias
David H
DH
D000497:Alloys / Q000737:chemistry*; D003460:Crystallization / Q000379:methods*; D017097:Electric Impedance; D004559:Electric Wiring; D006046:Gold / Q000737:chemistry; D006358:Hot Temperature; D008422:Materials Testing; D008968:Molecular Conformation; D049329:Nanostructures / Q000737:chemistry* / Q000648:ultrastructure*; D036103:Nanotechnology / Q000379:methods*; D009532:Nickel / Q000737:chemistry; D010316:Particle Size; D044367:Phase Transition; D013499:Surface Properties; D014001:Tin / Q000737:chemistry
D000497:Alloys; D014001:Tin; D006046:Gold; D009532:Nickel