Self-assembly of copper micro/nanoscale parallel wires by electrodeposition on a silicon substrate.
Zhang
Mingzhe
M
National Laboratory of Surperhard Materials and Institute of Atomic and Molecular Physics, Jilin University, Changchun 130012, China. zhangmz@jlu.edu.cn
Zuo
Guihong
G
Zong
Zhaocun
Z
Cheng
Haiyong
H
He
Zhi
Z
Yang
Cunming
C
Zou
Guangtian
G
D003300:Copper / Q000737:chemistry*; D003460:Crystallization / Q000379:methods*; D004559:Electric Wiring; D004595:Electroplating / Q000379:methods*; D046911:Macromolecular Substances / Q000737:chemistry; D008422:Materials Testing; D008968:Molecular Conformation; D036103:Nanotechnology / Q000379:methods*; D043942:Nanotubes / Q000737:chemistry* / Q000648:ultrastructure*; D010316:Particle Size; D012825:Silicon / Q000737:chemistry*; D013499:Surface Properties
D046911:Macromolecular Substances; D003300:Copper; D012825:Silicon