title: Self-assembly of copper micro/nanoscale parallel wires by electrodeposition on a silicon substrate.
authors.affiliation: National Laboratory of Surperhard Materials and Institute of Atomic and Molecular Physics, Jilin University, Changchun 130012, China. zhangmz@jlu.edu.cn
authors.forename: Mingzhe
authors.initials: M
authors.lastname: Zhang
authors.forename: Guihong
authors.initials: G
authors.lastname: Zuo
authors.forename: Zhaocun
authors.initials: Z
authors.lastname: Zong
authors.forename: Haiyong
authors.initials: H
authors.lastname: Cheng
authors.forename: Zhi
authors.initials: Z
authors.lastname: He
authors.forename: Cunming
authors.initials: C
authors.lastname: Yang
authors.forename: Guangtian
authors.initials: G
authors.lastname: Zou
mesh_terms: D003300:Copper / Q000737:chemistry*; D003460:Crystallization / Q000379:methods*; D004559:Electric Wiring; D004595:Electroplating / Q000379:methods*; D046911:Macromolecular Substances / Q000737:chemistry; D008422:Materials Testing; D008968:Molecular Conformation; D036103:Nanotechnology / Q000379:methods*; D043942:Nanotubes / Q000737:chemistry* / Q000648:ultrastructure*; D010316:Particle Size; D012825:Silicon / Q000737:chemistry*; D013499:Surface Properties
chemical_list: D046911:Macromolecular Substances; D003300:Copper; D012825:Silicon