title: Reflow and electrical characteristics of nanoscale solder.
authors.affiliation: Department of Chemical and Biomolecular Engineering, Johns Hopkins University, Baltimore, MD 21218, USA.
authors.forename: Zhiyong
authors.initials: Z
authors.lastname: Gu
authors.forename: Hongke
authors.initials: H
authors.lastname: Ye
authors.forename: Diana
authors.initials: D
authors.lastname: Smirnova
authors.forename: David
authors.initials: D
authors.lastname: Small
authors.forename: David H
authors.initials: DH
authors.lastname: Gracias
mesh_terms: D000497:Alloys / Q000737:chemistry*; D003460:Crystallization / Q000379:methods*; D017097:Electric Impedance; D004559:Electric Wiring; D006046:Gold / Q000737:chemistry; D006358:Hot Temperature; D008422:Materials Testing; D008968:Molecular Conformation; D049329:Nanostructures / Q000737:chemistry* / Q000648:ultrastructure*; D036103:Nanotechnology / Q000379:methods*; D009532:Nickel / Q000737:chemistry; D010316:Particle Size; D044367:Phase Transition; D013499:Surface Properties; D014001:Tin / Q000737:chemistry
chemical_list: D000497:Alloys; D014001:Tin; D006046:Gold; D009532:Nickel