title: A low-profile three-dimensional silicon/parylene stimulating electrode array for neural prosthesis applications.
abstract: This paper describes a low-profile three-dimensional silicon/parylene microelectrode array as basis for practical neural prostheses for use in the central nervous system. The circuit areas of the silicon probes, containing mixed-signal CMOS circuitry for neural stimulation/recording, can be folded over to reduce the overall height of the microassembled array above the cortical surface. The low- profile structure is implemented using multiple gold beams spaced by orthogonal silicon braces. An integrated silicon/parylene batch process is introduced to encapsulate these interconnects and achieve high yield.
authors.affiliation: Member, IEEE, Engineering Research Center for Wireless Integrated MicroSystems, University of Michigan, Ann Arbor, MI 48109-2122 USA.
authors.forename: Y
authors.initials: Y
authors.lastname: Yao
authors.forename: M N
authors.initials: MN
authors.lastname: Gulari
authors.forename: S
authors.initials: S
authors.lastname: Ghimire
authors.forename: J F
authors.initials: JF
authors.lastname: Hetke
authors.forename: K D
authors.initials: KD
authors.lastname: Wise