title: Xeno III self-etching adhesive in orthodontic bonding: the next generation.
abstract: BACKGROUND
  The newer single-step self-etching adhesives that etch, prime, and apply the resin bonding agent simultaneously without rinsing have been increasing in popularity in orthodontic bonding. The purpose of this study was to compare the bond strengths and to evaluate the debonding site (with the adhesive remnant index), when a conventional acid-etch conditioner and a self-etching adhesive system (Xeno III, Dentsply DeTrey GmbH, Konstanz, Germany) were used with either a composite resin adhesive (Transbond XT, 3M Unitek, Monrovia, Calif) or a resin-modified glass ionomer cement (Fuji Ortho LC, GC Corp, Tokyo, Japan).
  
  
  METHODS
  One hundred twenty extracted human premolars were mounted in acrylic resin and randomly assigned to 6 groups of 20 teeth each. Shear-peel bond strength testing was performed after thermocycling (5 degrees C-55 degrees C for 500 times) with a Zwick 1440 compression machine (Zwick, Ulm, Germany).
  
  
  RESULTS
  The results showed that the bond strengths achieved with Xeno III were comparable with the traditional methods of either 37% phosphoric acid or 10% polyacrylic acid for both Transbond XT and Fuji Ortho LC. Adhesive remnant index scores showed less adhesive remaining on the tooth surface in the Xeno III/Transbond XT adhesive only (no primer) group.
  
  
  CONCLUSIONS
  Xeno III can be used to bond orthodontic brackets with the adhesives in this study.
authors.affiliation: Department of Orthodontics, University of the Western Cape, Cape Town, South Africa. iamra@uwc.ac.za
authors.forename: Ismail
authors.initials: I
authors.lastname: Amra
authors.forename: Gilmie
authors.initials: G
authors.lastname: Samsodien
authors.forename: Amenah
authors.initials: A
authors.lastname: Shaikh
authors.forename: Ratilal
authors.initials: R
authors.lastname: Lalloo
mesh_terms: D000180:Acrylic Resins / Q000737:chemistry*; D000538:Aluminum Silicates / Q000737:chemistry*; D000704:Analysis of Variance; D001641:Bicuspid; D001840:Dental Bonding / Q000379:methods*; D017005:Dental Debonding / Q000009:adverse effects; D017220:Dentin-Bonding Agents / Q000737:chemistry*; D006801:Humans; D016910:Orthodontic Brackets; D019279:Resin Cements / Q000737:chemistry*; D033081:Shear Strength; D018709:Statistics, Nonparametric
chemical_list: D000180:Acrylic Resins; D000538:Aluminum Silicates; D017220:Dentin-Bonding Agents; C112133:Fuji Ortho; D019279:Resin Cements; C477790:Transbond XT; C487957:Xeno III