A low-profile three-dimensional silicon/parylene stimulating electrode array for neural prosthesis applications.
This paper describes a low-profile three-dimensional silicon/parylene microelectrode array as basis for practical neural prostheses for use in the central nervous system. The circuit areas of the silicon probes, containing mixed-signal CMOS circuitry for neural stimulation/recording, can be folded over to reduce the overall height of the microassembled array above the cortical surface. The low- profile structure is implemented using multiple gold beams spaced by orthogonal silicon braces. An integrated silicon/parylene batch process is introduced to encapsulate these interconnects and achieve high yield.
Yao
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Y
Member, IEEE, Engineering Research Center for Wireless Integrated MicroSystems, University of Michigan, Ann Arbor, MI 48109-2122 USA.
Gulari
M N
MN
Ghimire
S
S
Hetke
J F
JF
Wise
K D
KD