Development of an integrated microelectrode/microelectronic device for brain implantable neuroengineering applications.
An ultra-low power analog CMOS chip and a silicon based microelectrode array have been fully integrated to a microminiaturized "neuroport" for brain implantable neuroengineering applications. The CMOS IC included preamplifier and multiplexing circuitry, and a hybrid flip-chip bonding technique was developed to fabricate a functional , encapsulated microminiaturized neuroprobe device. As a proof-of-concept demonstration, we have measured local field potentials from thalamocortical brain slices of rats, suggesting that the new neuroport can form a prime platform for the development of a microminiaturized neural interface to the brain in a single implantable unit.
Song
Y-K
YK
Division of Engineering, Brown University, Providence, RI, USA.
Patterson
W R
WR
Bull
C W
CW
Hwang
N-J
NJ
Deangelis
A P
AP
Lay
C
C
McKay
J L
JL
Nurmikko
A V
AV
Donoghue
J D
JD
Connors
B W
BW