title: Development of an integrated microelectrode/microelectronic device for brain implantable neuroengineering applications.
abstract: An ultra-low power analog CMOS chip and a silicon based microelectrode array have been fully integrated to a microminiaturized "neuroport" for brain implantable neuroengineering applications. The CMOS IC included preamplifier and multiplexing circuitry, and a hybrid flip-chip bonding technique was developed to fabricate a functional , encapsulated microminiaturized neuroprobe device. As a proof-of-concept demonstration, we have measured local field potentials from thalamocortical brain slices of rats, suggesting that the new neuroport can form a prime platform for the development of a microminiaturized neural interface to the brain in a single implantable unit.
authors.affiliation: Division of Engineering, Brown University, Providence, RI, USA.
authors.forename: Y-K
authors.initials: YK
authors.lastname: Song
authors.forename: W R
authors.initials: WR
authors.lastname: Patterson
authors.forename: C W
authors.initials: CW
authors.lastname: Bull
authors.forename: N-J
authors.initials: NJ
authors.lastname: Hwang
authors.forename: A P
authors.initials: AP
authors.lastname: Deangelis
authors.forename: C
authors.initials: C
authors.lastname: Lay
authors.forename: J L
authors.initials: JL
authors.lastname: McKay
authors.forename: A V
authors.initials: AV
authors.lastname: Nurmikko
authors.forename: J D
authors.initials: JD
authors.lastname: Donoghue
authors.forename: B W
authors.initials: BW
authors.lastname: Connors