Rigiflex, spontaneously wettable polymeric mold for forming reversibly bonded nanocapillaries.
We present a novel ultraviolet (UV)-curable mold that enables the formation of reversibly bonded nanocapillaries (500-50 nm) on a gold or silicon substrate. A sheet-type ( approximately 50 microm) polyethylene diacrylate (PEG-DA) mold was used for its rigiflex nature; it provides rigidity high enough for maintaining nanostructures (elastic modulus >70 MPa) and also flexibility good enough for intimate contact over a large area aided by weak electrostatic forces (zeta potential approximately -113.55 mW). The electrostatic charge is generated on a rigiflex PEG-DA mold upon peeling from an original engraved silicon master by mechanical friction, thereby assisting the formation of spontaneous contact with the gold or silicon substrate.
Kim
Pilnam
P
School of Mechanical and Aerospace Engineering, Seoul National University, Seoul 151-742, Korea.
Suh
Kahp Y
KY
D000179:Acrylates / Q000737:chemistry; D006046:Gold; D008422:Materials Testing; D008855:Microscopy, Electron, Scanning; D015233:Models, Statistical; D053758:Nanoparticles / Q000737:chemistry*; D036103:Nanotechnology / Q000379:methods*; D011095:Polyethylenes / Q000737:chemistry; D011108:Polymers / Q000737:chemistry*; D012825:Silicon / Q000737:chemistry; D017550:Spectroscopy, Fourier Transform Infrared; D055672:Static Electricity; D013499:Surface Properties; D013696:Temperature; D013997:Time Factors
D000179:Acrylates; D011095:Polyethylenes; D011108:Polymers; D006046:Gold; D012825:Silicon