title: A study on the effects of temperature and volume fraction on thermal conductivity of copper oxide nanofluid.
abstract: By using copper oxide nanofluid fabricated by the self-made Submerged Arc Nanofluid Synthesis System (SANSS), this paper measures the thermal conductivity under different volume fractions and different temperatures by thermal properties analyzer, and analyzes the correlation among the thermal conductivity, volume fraction, and temperature of nanofluid. The CuO nanoparticles used in the experiment are needle-like, with a mean particle size of about 30 nm. They can be stably suspended in deionized water for a long time. The experimental results show that under the condition that the temperature is 40 degrees C, when the volume fraction of nanofluid increases from 0.2% to 0.8%, the thermal conductivity increment of the prepared nanofluid towards deionized water can be increased from 14.7% to 38.2%. Under the condition that the volume fraction is 0.8%, as the temperature of nanofluid rises from 5 degrees C to 40 degrees C, the thermal conductivity increment of the prepared nanofluid towards deionized water increases from 5.9% to 38.2%. Besides, the effects of temperature change are greater than the effects of volume fraction on the thermal conductivity of nanofluid. Therefore, when the self-made copper oxide nanofluid is applied to the heat exchange device under medium and high temperature, an optimal radiation effect can be acquired.
authors.affiliation: Department of Air-Conditioning and Refrigeration Engineering, National Taipei University of Technology, Taipei 106, Taiwan, Republic of China.
authors.forename: Ching-Song
authors.initials: CS
authors.lastname: Jwo
authors.forename: Ho
authors.initials: H
authors.lastname: Chang
authors.forename: Tun-Ping
authors.initials: TP
authors.lastname: Teng
authors.forename: Mu-Jnug
authors.initials: MJ
authors.lastname: Kao
authors.forename: Yu-Ting
authors.initials: YT
authors.lastname: Guo
mesh_terms: D003198:Computer Simulation; D003300:Copper / Q000737:chemistry*; D003460:Crystallization / Q000379:methods; D004735:Energy Transfer; D046911:Macromolecular Substances / Q000737:chemistry; D008422:Materials Testing; D044085:Microfluidics / Q000379:methods*; D008956:Models, Chemical; D008958:Models, Molecular; D008968:Molecular Conformation; D049329:Nanostructures / Q000737:chemistry* / Q000648:ultrastructure*; D036103:Nanotechnology / Q000379:methods*; D010316:Particle Size; D013499:Surface Properties; D013696:Temperature; D013814:Thermal Conductivity
chemical_list: D046911:Macromolecular Substances; D003300:Copper; C030973:cupric oxide