title: MICROELECTRONICS: Flip the Chip.
abstract: As integrated circuit fabrication advances rapidly and the market for faster, lighter, smaller, yet less expensive electronic products accelerates, electronic packaging faces its own challenges. In this Perspective, Wong, Luo, and Zhang describe recent advances in flip chip packaging. This technology has many advantages over the conventional wire bonding technology and offers the possibility of low-cost electronic assembly for modern electronic products.
authors.forename: C P
authors.initials: CP
authors.lastname: Wong
authors.forename: S
authors.initials: S
authors.lastname: Luo
authors.forename: Z
authors.initials: Z
authors.lastname: Zhang