Electrodeposited submicron thermocouples with microsecond response times.
We describe a procedure for preparing submicron scale silver-nickel thermocouples (TCs) using electrochemical step edge decoration on graphite surfaces. Each fabrication operation produced ensembles of 2-20 TCs with diameters in the 1.0 microm to 500 nm range. These "sub-mum TCs" (SMTCs) produced linear voltage versus temperature output over the range from 20 to 100 degrees C characterized by a Seebeck coefficient of 20 +/- 1 microV/degrees C, equal to the 21 microV/degrees C that is theoretically expected for a junction between these two metals. The time response of SMTCs was evaluated using two different laser-heating methods and compared with the smallest mechanically robust commercially available type J TCs. Electrochemical etching of the silver wire introduced constrictions at grain boundaries that reduced the thermal mass of the junction without altering its integrity or its overall diameter, producing a decrease of the measured rise time for SMTCs up to 96%.
Bourg
M E
ME
Department of Chemistry and Institute for Surface and Interface Science, University of California, Irvine, California 92697-2025, USA.
van der Veer
W E
WE
Güell
A G
AG
Grüell
A G
AG
Penner
R M
RM
D004563:Electrochemistry / Q000295:instrumentation* / Q000379:methods; D004595:Electroplating / Q000379:methods*; D004867:Equipment Design; D019544:Equipment Failure Analysis; D036103:Nanotechnology / Q000295:instrumentation* / Q000379:methods; D009532:Nickel / Q000737:chemistry*; D015203:Reproducibility of Results; D012680:Sensitivity and Specificity; D012834:Silver / Q000737:chemistry*; D013817:Thermography / Q000295:instrumentation* / Q000379:methods; D014159:Transducers
D012834:Silver; D009532:Nickel