title: Solder-based chip-to-tube and chip-to-chip packaging for microfluidic devices.
abstract: Constructing a microsystem compatible with a large variety of chemistries requires a system design that will be robust in the presence of different compounds and at a wide range of conditions. Although microreactors themselves can accommodate a great span of conditions, few packaging schemes are compatible with cryogenic temperatures, high pressures, and aggressive organic solvents. Solder-based connections are designed and implemented on silicon-based microreactors and are demonstrated to withstand elevated pressures (up to 200 atm), a wide range of temperatures (-78 to 160 degrees C) and a variety of solvent systems. Through the deposition of metal bonding pads directly onto silicon and glass surfaces, solder-based chip-to-tube connections can be reliably formed using handheld soldering tools. Packaging techniques are also described for fluidic chip-to-chip bonds, facilitating direct connection of microfluidic modules. This method greatly expands the utility of microfluidic reactors while enabling easy and reproducible fluidic packaging.
authors: Dept. of Chemical Engineering, Massachusetts Institute of Technology, 77 Massachusetts Ave., Cambridge, MA 02139, USA.
authors: Edward R
authors: ER
authors: Murphy
authors: Tomoya
authors: T
authors: Inoue
authors: Hemantkumar R
authors: HR
authors: Sahoo
authors: Nikolay
authors: N
authors: Zaborenko
authors: Klavs F
authors: KF
authors: Jensen