title: Preliminary study of the thermal impact of a microelectrode array implanted in the brain.
abstract: One requirement of a chronically implantable, wireless neural interface device is the integration of electronic circuitry with the microelectrode array. Since the electronic IC dissipates a certain amount of power, it will affect the temperature in the tissues surrounding the implant site. In this paper, the thermal influence of an integrated, 3-dimensional Utah electrode array, to be implanted in the brain was investigated with simulations using the finite element method (FEM). A temperature increase in the brain tissue was predicted using preliminary simulations with simplified models. The model and method used in the simulations were verified by simple in vitro experiments.
authors.affiliation: Dept. of Electr. & Comput. Sci., Utah Univ., Salt Lake City, UT 84112, USA.
authors.forename: Sohee
authors.initials: S
authors.lastname: Kim
authors.forename: Richard A
authors.initials: RA
authors.lastname: Normann
authors.forename: Reid
authors.initials: R
authors.lastname: Harrison
authors.forename: Florian
authors.initials: F
authors.lastname: Solzbacher
mesh_terms: D000818:Animals; D001698:Biomedical Engineering; D003198:Computer Simulation; D004567:Electrodes, Implanted / Q000009:adverse effects; D020342:Finite Element Analysis; D006358:Hot Temperature; D006801:Humans; D066298:In Vitro Techniques; D008328:Man-Machine Systems; D008839:Microelectrodes / Q000009:adverse effects; D008959:Models, Neurological; D013814:Thermal Conductivity