A multi-chip-architecture based flexible stimulation device for retinal prosthesis with a flip-chip packaging technique.
In the present work, we designed a multi-chip-architecture based flexible neural stimulation device for retinal prosthesis. Based on the multi-chip architecture, a novel CMOS stimulation device was successfully designed and characterized. A packaging technique for thin, flexible neural stimulation device was also proposed and demonstrated. Flip-chip bonding technology plays an essential role in the fabrication of the present thin and flexible neural stimulation device.
Tokuda
T
T
Nara Inst. of Sci. & Technol., Nara, Japan. tokuda@ms.naist.jp
Kawada
M
M
Sugitani
S
S
Taniyama
M
M
Uehara
A
A
Kagawa
K
K
Nunoshita
M
M
Ohta
J
J
D000818:Animals; D001698:Biomedical Engineering; D004558:Electric Stimulation; D004567:Electrodes, Implanted; D006801:Humans; D008328:Man-Machine Systems; D011474:Prosthesis Design; D012160:Retina / Q000502:physiology