Active electrode arrays by chip embedding in a flexible silicone carrier.
Future cochlear implants demand a higher density of stimulation sites (electrodes) and enhanced functionality (e.g. feedback information). The current generation of implanted cochlear prostheses is making use of a completely "passive scheme" and cannot meet these requirements. An "all-silicon" concept integrating active components with passive electrodes in silicon has been proposed but does not offer the flexibility/stretchability of current silicone-based devices. This paper introduces a novel concept based on silicon chip embedding in a flexible silicone carrier. The process and experimental results will be presented. The concept is also applicable to other types of implanted electrodes, e.g. retinal implants.
Vanden Bulcke
Mathieu
M
Interuniv. Micro Electron. Center, Leuven, Belgium. Mathieu.VandenBulcke@imec.be
Baert
Kris
K
Beyne
Eric
E
Gonzalez
Mario
M
Winters
Christophe
C
Webers
Tomas
T
D020099:Coated Materials, Biocompatible / Q000737:chemistry; D003054:Cochlear Implants; D004548:Elasticity; D004599:Electric Stimulation Therapy / Q000295:instrumentation*; D004867:Equipment Design; D019544:Equipment Failure Analysis; D008839:Microelectrodes; D012828:Silicones
D020099:Coated Materials, Biocompatible; D012828:Silicones