Microassembly techniques for a three-dimensional neural stimulating microelectrode array.
This paper describes microassembly techniques for an out-of-plane three-dimensional microelectrode array for neural stimulating and recording in the central nervous system. An interlocking mechanism has been introduced into the microassembly components to facilitate the process, increase the robustness of the assembled device and improve the yield of the overall system. In-vivo testing has demonstrated full functionality of the microassembled 3D array.
Yao
Y
Y
Eng. Res. Center for Wireless Integrated Microsyst., Michigan Univ., Ann Arbor, MI 48109-2122, USA.
Gulari
M N
MN
Wise
K D
KD
D000669:Amplifiers, Electronic; D000818:Animals; D001303:Auditory Cortex / Q000473:pathology; D003198:Computer Simulation; D004558:Electric Stimulation; D004567:Electrodes, Implanted; D004867:Equipment Design; D006168:Guinea Pigs; D021621:Imaging, Three-Dimensional; D008838:Microcomputers; D008839:Microelectrodes; D009420:Nervous System; D009474:Neurons / Q000473:pathology*; D012815:Signal Processing, Computer-Assisted; D014173:Transistors, Electronic