A parylene-silicon cochlear electrode array with integrated position sensors.
A thin-film cochlear electrode array has been developed for a cochlear prosthesis to achieve improved sound perception and position accuracy. The array is fabricated using a bulk-silicon micromachining process that allows parylene deposition and patterning at wafer level, followed by a wet silicon release etch that is compatible with the use of boron etch-stops. The process is capable of realizing arrays with substrates stressed to hug the modiolar wall in the rest state and whose stiffness can be adjusted over a wide range. Built-in tip and curvature sensors respond to tip contact and bending-induced shank stress, respectively during in-vitro and in-vivo implants. The process is also compatible with the integration of parylene ribbon cables for lead transfer to an implanted electronics package.
Wang
Jianbai
J
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI 48109, USA. jianbaiw@umich.edu
Gulari
Mayurachat N
MN
Wise
Kensall D
KD
D000818:Animals; D001698:Biomedical Engineering; D003054:Cochlear Implants; D004567:Electrodes, Implanted; D004582:Electronics, Medical / Q000295:instrumentation; D006168:Guinea Pigs; D006801:Humans; D008839:Microelectrodes; D011108:Polymers; D011474:Prosthesis Design; D012825:Silicon; D014992:Xylenes
D011108:Polymers; D014992:Xylenes; C011055:parylene; D012825:Silicon