title: A multi-chip-architecture based flexible stimulation device for retinal prosthesis with a flip-chip packaging technique.
abstract: In the present work, we designed a multi-chip-architecture based flexible neural stimulation device for retinal prosthesis. Based on the multi-chip architecture, a novel CMOS stimulation device was successfully designed and characterized. A packaging technique for thin, flexible neural stimulation device was also proposed and demonstrated. Flip-chip bonding technology plays an essential role in the fabrication of the present thin and flexible neural stimulation device.
authors.affiliation: Nara Inst. of Sci. & Technol., Nara, Japan. tokuda@ms.naist.jp
authors.forename: T
authors.initials: T
authors.lastname: Tokuda
authors.forename: M
authors.initials: M
authors.lastname: Kawada
authors.forename: S
authors.initials: S
authors.lastname: Sugitani
authors.forename: M
authors.initials: M
authors.lastname: Taniyama
authors.forename: A
authors.initials: A
authors.lastname: Uehara
authors.forename: K
authors.initials: K
authors.lastname: Kagawa
authors.forename: M
authors.initials: M
authors.lastname: Nunoshita
authors.forename: J
authors.initials: J
authors.lastname: Ohta
mesh_terms: D000818:Animals; D001698:Biomedical Engineering; D004558:Electric Stimulation; D004567:Electrodes, Implanted; D006801:Humans; D008328:Man-Machine Systems; D011474:Prosthesis Design; D012160:Retina / Q000502:physiology