title: Radiofrequency power deposition near metallic wires during MR imaging: feasibility study using T1-weighted thermal imaging.
abstract: The presence of metallic conductors (implants, wires or catheters) is prohibited in MR imaging for safety purpose with respect to radiofrequency (RF) power deposition caused by RF excitation B1 field. This work describes the use of T1-weigthed MR imaging for estimating a thermal map around a metallic (copper) wire located in the center of a MR imaging unit during an imaging sequence. The experimental set up and the methodology used for capturing the elevation of temperature created by radiofrequency power deposition around the wire is presented. A proof of its efficiency to followup temperature elevation about 0,5 degrees C in a milimetric region of interest (pixel size: 1 x 1 mm2, slice thickness 5 mm) located around the wire is given, leading to further developments of MR imaging in presence of metallic implants, coils or catheters.
authors.affiliation: Creatis-LRMN Laboratory, UMR CNRS INSA UCBL 5220, INSERM U630, Université de Lyon, France.
authors.forename: F
authors.initials: F
authors.lastname: Oulmane
authors.forename: V
authors.initials: V
authors.lastname: Detti
authors.forename: D
authors.initials: D
authors.lastname: Grenier
authors.forename: E
authors.initials: E
authors.lastname: Perrin
authors.forename: H
authors.initials: H
authors.lastname: Saint-Jalmes
mesh_terms: D001864:Bone Wires; D003300:Copper; D006358:Hot Temperature; D006801:Humans; D008279:Magnetic Resonance Imaging / Q000295:instrumentation; D019047:Phantoms, Imaging
chemical_list: D003300:Copper