title: A microsystem integration platform dedicated to build multi-chip-neural interfaces.
abstract: In this paper, we present an electrical discharge machining (EDM) technique associated with electrochemical steps to construct an appropriate biological interface to neural tissues. The presented microprobe design permits to short the time of production compared to available techniques, while improving the integrity of the electrodes. In addition, we are using a 3D approach to create compact and independent microsystem integration platefrom incorporating array of electrodes and signal processing chips. System-in-package and die-stacking are used to connect the integrated circuits and the array of electrodes on the platform. This approach enables to build a device that will fit in a volume smaller than 1.7 x 1.7 x 3.0 mm(3). This demonstrates the possibility of creating small devices that are suitable to fit in restricted areas for interfacing the brain.
authors.affiliation: Electrical Engineering Department, Ecole Polytechnique de Montréal, Montréal, PQ H3C 3A7, Canada. amer-elias.ayoub@polymtl.ca
authors.forename: Amer E
authors.initials: AE
authors.lastname: Ayoub
authors.forename: Benoit
authors.initials: B
authors.lastname: Gosselin
authors.forename: Mohamad
authors.initials: M
authors.lastname: Sawan
mesh_terms: D001672:Biocompatible Materials; D001921:Brain; D004563:Electrochemistry; D004567:Electrodes, Implanted; D004867:Equipment Design; D008839:Microelectrodes; D019736:Prostheses and Implants; D013193:Stainless Steel; D013686:Telemetry / Q000295:instrumentation*
chemical_list: D001672:Biocompatible Materials; D013193:Stainless Steel