Electron-phonon interaction model and prediction of thermal energy transport in SOI transistor.
An electron-phonon interaction model is proposed and applied to thermal transport in semiconductors at micro/nanoscales. The high electron energy induced by the electric field in a transistor is transferred to the phonon system through electron-phonon interaction in the high field region of the transistor. Due to this fact, a hot spot occurs, which is much smaller than the phonon mean free path in the Si-layer. The full phonon dispersion model based on the Boltzmann transport equation (BTE) with the relaxation time approximation is applied for the interactions among different phonon branches and different phonon frequencies. The Joule heating by the electron-phonon scattering is modeled through the intervalley and intravalley processes for silicon by introducing average electron energy. The simulation results are compared with those obtained by the full phonon dispersion model which treats the electron-phonon scattering as a volumetric heat source. The comparison shows that the peak temperature in the hot spot region is considerably higher and more localized than the previous results. The thermal characteristics of each phonon mode are useful to explain the above phenomena. The optical mode phonons of negligible group velocity obtain the highest energy density from electrons, and resides in the hot spot region without any contribution to heat transport, which results in a higher temperature in that region. Since the acoustic phonons with low group velocity show the higher energy density after electron-phonon scattering, they induce more localized heating near the hot spot region. The ballistic features are strongly observed when phonon-phonon scattering rates are lower than 4 x 10(10) S(-1).
Jin
Jae Sik
JS
School of Mechanical and Aerospace Engineering, Seoul National University, Seoul 151-742, Korea.
Lee
Joon Sik
JS
D003198:Computer Simulation; D017076:Computer-Aided Design; D004583:Electrons; D004735:Energy Transfer; D004867:Equipment Design; D019544:Equipment Failure Analysis; D006358:Hot Temperature; D008962:Models, Theoretical; D036103:Nanotechnology / Q000295:instrumentation*; D017785:Photons; D013814:Thermal Conductivity; D014173:Transistors, Electronic