title: High-density flexible interconnect for two-dimensional ultrasound arrays.
abstract: We present a method for fabricating flexible multilayer circuits for interconnection to 2-D array ultrasound transducers. In addition, we describe four 2-D arrays in which such flexible interconnect is implemented, including transthoracic arrays with 438 channels operating at up to 7 MHz and intracardiac catheter arrays with 70 channels operating at up to 7 MHz. We employ thin and thick film microfabrication techniques to batch produce the interconnect circuits with minimum dimensions of 12-mum lines, 40-mum vias, and 150-mum array pitch. The arrays show 50-Omega insertion loss of -60 to -84 dB and a fractional bandwidth of 27 to 67%. The arrays are used to obtain real time, in vivo volumetric scans.
authors.forename: J O
authors.initials: JO
authors.lastname: Fiering
authors.forename: P
authors.initials: P
authors.lastname: Hultman
authors.forename: W
authors.initials: W
authors.lastname: Lee
authors.forename: E D
authors.initials: ED
authors.lastname: Light
authors.forename: S W
authors.initials: SW
authors.lastname: Smith