A combined top-down and bottom-up approach for precise placement of metal nanoparticles on silicon.
Choi
Wee Kiong
WK
Microelectronics Laboratory, Department of Electrical and Computer Engineering, National University of Singapore, 117576 Singapore, Singapore. elechoi@nus.edu.sg
Liew
Tze Haw
TH
Chew
Han Guan
HG
Zheng
Fei
F
Thompson
Carl V
CV
Wang
Yang
Y
Hong
Ming Hui
MH
Wang
Xiao Dong
XD
Li
Liang
L
Li
Li
L
Yun
Jia
J
D006046:Gold / Q000737:chemistry; D053768:Metal Nanoparticles; D008855:Microscopy, Electron, Scanning; D012825:Silicon / Q000737:chemistry*; D013499:Surface Properties
D006046:Gold; D012825:Silicon