title: A combined top-down and bottom-up approach for precise placement of metal nanoparticles on silicon.
authors.affiliation: Microelectronics Laboratory, Department of Electrical and Computer Engineering, National University of Singapore, 117576 Singapore, Singapore. elechoi@nus.edu.sg
authors.forename: Wee Kiong
authors.initials: WK
authors.lastname: Choi
authors.forename: Tze Haw
authors.initials: TH
authors.lastname: Liew
authors.forename: Han Guan
authors.initials: HG
authors.lastname: Chew
authors.forename: Fei
authors.initials: F
authors.lastname: Zheng
authors.forename: Carl V
authors.initials: CV
authors.lastname: Thompson
authors.forename: Yang
authors.initials: Y
authors.lastname: Wang
authors.forename: Ming Hui
authors.initials: MH
authors.lastname: Hong
authors.forename: Xiao Dong
authors.initials: XD
authors.lastname: Wang
authors.forename: Liang
authors.initials: L
authors.lastname: Li
authors.forename: Li
authors.initials: L
authors.lastname: Li
authors.forename: Jia
authors.initials: J
authors.lastname: Yun
mesh_terms: D006046:Gold / Q000737:chemistry; D053768:Metal Nanoparticles; D008855:Microscopy, Electron, Scanning; D012825:Silicon / Q000737:chemistry*; D013499:Surface Properties
chemical_list: D006046:Gold; D012825:Silicon