title: Optomechanical design and characterization of a printed-circuit-board-based free-space optical interconnect package.
abstract: We present a proof of concept and a feasibility demonstration of a practical packaging approach in which free-space optical interconnects (FSOI's) can be integrated simply on electronic multichip modules (MCM's) for intra-MCM-board interconnects. Our system-level packaging architecture is based on a modified folded 4f imaging system that has been implemented with only off-the-shelf optics, conventional electronic packaging, and passive-assembly techniques to yield a potentially low-cost and manufacturable packaging solution. The prototypical system as built supports 48 independent FSOI channels with 8 separate laser and detector chips, for which each chip consists of a one-dimensional array of 12 devices. All the chips are assembled on a single substrate that consists of a printed circuit board or a ceramic MCM. Optical link channel efficiencies of greater than 90% and interchannel cross talk of less than -20 dB at low frequency have been measured. The system is compact at only 10 in.3 (25.4 cm3) and is scalable, as it can easily accommodate additional chips as well as two-dimensional optoelectronic device arrays for increased interconnection density.
authors.affiliation: Department of Electrical and Computer Engineering, University of California at San Diego, La Jolla, California 92093-0407, USA. xzheng@ece.ucsd.edu
authors.forename: X
authors.initials: X
authors.lastname: Zheng
authors.forename: P J
authors.initials: PJ
authors.lastname: Marchand
authors.forename: D
authors.initials: D
authors.lastname: Huang
authors.forename: O
authors.initials: O
authors.lastname: Kibar
authors.forename: N S
authors.initials: NS
authors.lastname: Ozkan
authors.forename: S C
authors.initials: SC
authors.lastname: Esener