title: Temperature evolution of spin relaxation in a NiFe/Cu lateral spin valve.
abstract: Temperature dependence of spin relaxation process in a Cu wire has been studied by means of nonlocal spin-valve measurements. The spin-diffusion length of the Cu wire is found to take maximum at the characteristic temperature, below which the spin-diffusion length is reduced. The mechanism of the reduction can be explained by considering the spin-flip scattering due to the oxidized surface of the Cu wire. The thickness dependence of the characteristic temperature supports the interpretation with the surface oxidation.
authors: Institute for Solid State Physics, University of Tokyo, 5-1-5 Kashiwanoha, Kashiwa, Chiba 277-8581, Japan.
authors: T
authors: T
authors: Kimura
authors: T
authors: T
authors: Sato
authors: Y
authors: Y
authors: Otani