title: Stretchable and foldable silicon integrated circuits.
abstract: We have developed a simple approach to high-performance, stretchable, and foldable integrated circuits. The systems integrate inorganic electronic materials, including aligned arrays of nanoribbons of single crystalline silicon, with ultrathin plastic and elastomeric substrates. The designs combine multilayer neutral mechanical plane layouts and "wavy" structural configurations in silicon complementary logic gates, ring oscillators, and differential amplifiers. We performed three-dimensional analytical and computational modeling of the mechanics and the electronic behaviors of these integrated circuits. Collectively, the results represent routes to devices, such as personal health monitors and other biomedical devices, that require extreme mechanical deformations during installation/use and electronic properties approaching those of conventional systems built on brittle semiconductor wafers.
authors: Department of Materials Science and Engineering, Beckman Institute, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, 1304 West Green Street, Urbana, IL 61801, USA.
authors: Dae-Hyeong
authors: DH
authors: Kim
authors: Jong-Hyun
authors: JH
authors: Ahn
authors: Won Mook
authors: WM
authors: Choi
authors: Hoon-Sik
authors: HS
authors: Kim
authors: Tae-Ho
authors: TH
authors: Kim
authors: Jizhou
authors: J
authors: Song
authors: Yonggang Y
authors: YY
authors: Huang
authors: Zhuangjian
authors: Z
authors: Liu
authors: Chun
authors: C
authors: Lu
authors: John A
authors: JA
authors: Rogers