Trimming of silicon ring resonator by electron beam induced compaction and strain.
Silicon is becoming the preferable platform for future integrated components, mostly due to the mature and reliable fabrication capabilities of electronics industry. Nevertheless, even the most advanced fabrication technologies suffer from non-uniformity on wafer scale and on chip scale, causing variations in the critical dimensions of fabricated components. This is an important issue since photonic circuits, and especially cavities such as ring resonators, are extremely sensitive to these variations. In this paper we present a way to circumvent these problems by trimming using electron beam induced compaction of oxide in silicon on insulator. Volume compaction of the oxide cladding causes both changes in the refractive index and creates strain in the silicon lattice. We demonstrate a resonance wavelength red shift 4.91 nm in a silicon ring resonator.
Schrauwen
J
J
Photonics Research Group, Department of Information Technology, Ghent University - IMEC, B-9000 Gent, Belgium. jonathan.schrauwen@intec.ugent.be
Van Thourhout
D
D
Baets
R
R
D004548:Elasticity; D004583:Electrons; D004867:Equipment Design / Q000379:methods*; D019544:Equipment Failure Analysis; D008422:Materials Testing; D055095:Optics and Photonics / Q000295:instrumentation*; D012825:Silicon / Q000737:chemistry* / Q000528:radiation effects*; D013314:Stress, Mechanical
D012825:Silicon