Buried Ni/Cu(001) interface at the atomic scale.
We present a quantitative surface x-ray analysis of the buried Ni/Cu(001) interface structure after deposition of 3 and 5 monolayers of Ni at room temperature. Interface mixing is found where 27+/-10% of top layer Cu atoms are exchanged by Ni. Atomic scale simulations reveal a kinetic pathway for the Ni/Cu-exchange process and explain the observed limited degree of intermixing. A disperse distribution of Ni within the Cu surface with a preferential Ni-Ni separation of 3-4 nearest neighbor distances is determined.
Max-Planck-Institut für Mikrostrukturphysik, Weinberg 2, D-06120 Halle, Germany. hmeyerhm@mpi-halle.mpg.de
H L
HL
Meyerheim
D
D
Sander
N N
NN
Negulyaev
V S
VS
Stepanyuk
R
R
Popescu
I
I
Popa
J
J
Kirschner