Nanostructured copper interfaces for enhanced boiling.
Li
Chen
C
Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309, USA.
Wang
Zuankai
Z
Wang
Pei-I
PI
Peles
Yoav
Y
Koratkar
Nikhil
N
Peterson
G P
GP
D003300:Copper; D005740:Gases; D006358:Hot Temperature; D008855:Microscopy, Electron, Scanning; D049329:Nanostructures / Q000648:ultrastructure; D043942:Nanotubes / Q000648:ultrastructure; D044367:Phase Transition; D013499:Surface Properties
D005740:Gases; D003300:Copper