Chip- and board-level optical interconnections using rigid flexible optical electrical printed circuit boards.
A new optical interconnection scheme based on a rigid flexible optical electrical printed circuit board (RFOE-PCB) is suggested. The easily installed RFOE-PCB can be universally applied for both chip- and board-level optical interconnections. This letter describes the detailed fabrication process, optical properties, and heat-resisting property of the RFOE-PCB. The fabricated RFOE-PCB was also successfully demonstrated with a 2.5-Gb/s data transmission through a 45 degrees-ended optical waveguide embedded in the RFOE-PCB.
Integrated Optical Module Laboratory, Korea Photonics Technology Institute, Gwangju 500-460, Korea.
S H
SH
Hwang
W-J
WJ
Lee
J W
JW
Lim
K Y
KY
Jung
K S
KS
Cha
B S
BS
Rho
D003198:Computer Simulation; D017076:Computer-Aided Design; D004581:Electronics / Q000295:instrumentation*; D004867:Equipment Design; D019544:Equipment Failure Analysis; D008027:Light; D008962:Models, Theoretical; D055095:Optics and Photonics / Q000295:instrumentation*; D011327:Printing / Q000295:instrumentation; D012542:Scattering, Radiation