Semiconductor wires and ribbons for high-performance flexible electronics.
This article reviews the properties, fabrication and assembly of inorganic semiconductor materials that can be used as active building blocks to form high-performance transistors and circuits for flexible and bendable large-area electronics. Obtaining high performance on low temperature polymeric substrates represents a technical challenge for macroelectronics. Therefore, the fabrication of high quality inorganic materials in the form of wires, ribbons, membranes, sheets, and bars formed by bottom-up and top-down approaches, and the assembly strategies used to deposit these thin films onto plastic substrates will be emphasized. Substantial progress has been made in creating inorganic semiconducting materials that are stretchable and bendable, and the description of the mechanics of these form factors will be presented, including circuits in three-dimensional layouts. Finally, future directions and promising areas of research will be described.
Baca
Alfred J
AJ
Department of Chemistry and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Ahn
Jong-Hyun
JH
Sun
Yugang
Y
Meitl
Matthew A
MA
Menard
Etienne
E
Kim
Hoon-Sik
HS
Choi
Won Mook
WM
Kim
Dae-Hyeong
DH
Huang
Young
Y
Rogers
John A
JA