title: Effect of dentinal surface preparation on bond strength of self-etching adhesives.
abstract: OBJECTIVE
  This study examined the effects of cutting dentin with different burs at various speeds on the microtensile bond strength (muTBS) of two self-etching adhesive systems.
  
  
  METHODS
  Flat deep dentin surfaces from 50 extracted human third molars were divided into 5 groups (n = 10) according to bur type and speed of rotation: (I) high-speed diamond bur, (II) low-speed diamond bur, (III) high-speed tungsten carbide bur, (IV) low-speed tungsten carbide bur. Controls were abraded with 600-grit SiC paper. A two-step self-etching adhesive, Clearfil SE Bond (SE, Kuraray) and a one-step self-etching adhesive, Clearfil S3 Bond (S3, Kuraray) were applied to dentin surfaces and light cured. Composite buildups were performed using Filtek Z250 (3M ESPE). For lTBS evaluation, composite-dentin beams of 0.8 mm2 were stressed to failure at a crosshead speed of 1 mm/min. The muTBS data were analyzed using two-way ANOVA and Tukey's multiple comparison tests. Representative fractured beams from each group were prepared for fractographic analysis under SEM.
  
  
  RESULTS
  Two-way ANOVA showed that the effects of dentin surface preparations, adhesive systems, and their interaction were statistically significant (p < 0.001). The muTBS was the highest when bonding SE to dentin surface prepared with 600-grit SiC abrasive paper (47.3 +/- 7.4 MPa), followed by high-speed tungsten carbide burs (40.8 +/- 6.1 MPa), and the lowest when bonding S3 to dentin surfaces prepared with a high-speed diamond bur (15.2 +/- 6.2 MPa). SEM observation of the fractured surfaces revealed mixed and adhesive failures for SE groups, while in the S3 groups, adhesive failures predominated with numerous inclusion droplets.
  
  
  CONCLUSIONS
  Higher bond strengths are achieved with SE bond when applied on dentin surfaces prepared with tungsten carbide burs. Proper bur and adhesive selection are essential to optimize dentin adhesion of self-etching adhesives.
authors.affiliation: Faculty of Dentistry, The University of Hong Kong, Prince Philip Dental Hospital, 34 Hospital Road, Hong Kong SAR, China. ckyyiu@hkucc.hku.hk
authors.forename: Cynthia K Y
authors.initials: CK
authors.lastname: Yiu
authors.forename: Noriko
authors.initials: N
authors.lastname: Hiraishi
authors.forename: Nigel M
authors.initials: NM
authors.lastname: King
authors.forename: Franklin R
authors.initials: FR
authors.lastname: Tay
mesh_terms: D000268:Adhesiveness; D017554:Carbon Compounds, Inorganic / Q000737:chemistry; D003188:Composite Resins / Q000737:chemistry; D001840:Dental Bonding; D003754:Dental High-Speed Equipment; D003804:Dentin / Q000648:ultrastructure*; D017220:Dentin-Bonding Agents / Q000737:chemistry*; D018130:Diamond / Q000737:chemistry; D006801:Humans; D008855:Microscopy, Electron, Scanning; D019279:Resin Cements / Q000737:chemistry; D017655:Silicon Compounds / Q000737:chemistry; D013314:Stress, Mechanical; D013499:Surface Properties; D013718:Tensile Strength; D019246:Tooth Preparation / Q000295:instrumentation / Q000379:methods*; D017973:Tungsten Compounds / Q000737:chemistry
chemical_list: D017554:Carbon Compounds, Inorganic; C505694:Clearfil S3 Bond; C438313:Clearfil SE Bond; D003188:Composite Resins; D017220:Dentin-Bonding Agents; C444701:Filtek Z250; D019279:Resin Cements; D017655:Silicon Compounds; D017973:Tungsten Compounds; C002802:tungsten carbide; D018130:Diamond; C022088:silicon carbide