title: Nondestructive method for reconnecting aluminum metallization on integrated circuits.
abstract: A failure analysis technique for reconnecting aluminum metallization on planar IC devices is described. The technique, utilizing a conductive paint deposited on the device surface, is nondestructive and easily removable.
authors.affiliation: Raytheon Company, Equipment Development Laboratories, Sudbury, Massachusetts 01776, USA.
authors.forename: A D
authors.initials: AD
authors.lastname: Zubatkin