Tensile bond strength of one-step self-etch adhesives to Er:YAG laser-irradiated and non-irradiated enamel.
This study determined the bond strengths to Er:YAG laser-irradiated and non-irradiated bovine enamel of three one-step self-etch adhesives (AQ Bond Plus (AQP), G-Bond (GB), and Clearfil Tri-S Bond (TS)) and one two-step self-etch adhesive (Clearfil Megabond (MB)). Eighty SiC paper-ground bovine enamel surfaces were used, of which half were laser-irradiated. The enamel surfaces were bonded to a resin composite with each adhesive, and tensile bond strengths were determined after 24 hours. For non-irradiated enamel groups, MB achieved greater bond strength to enamel than GB and TS (p < 0.05), but no significant difference was found between MB and AQP (p > 0.05). For laser-irradiated enamel groups, no significant differences were found among the four adhesives (p > 0.05). Additionally, for each adhesive, no significant differences were found between laser-irradiated and non-irradiated enamel. It was thus concluded that Er: YAG laser irradiation of enamel did not affect the tensile bond strength of one-step and two-step self-etch adhesives.
Kameyama
Atsushi
A
Department of Operative Dentistry, Tokyo Dental College, 1-2-2 Masago, Mihama-ku, Chiba 261-8502, Japan. kameyama@tdc.ac.jp
Kato
Junji
J
Aizawa
Koya
K
Suemori
Tsuyoshi
T
Nakazawa
Yuichi
Y
Ogata
Tsuyoshi
T
Hirai
Yoshito
Y
D000818:Animals; D017554:Carbon Compounds, Inorganic / Q000737:chemistry; D002417:Cattle; D003188:Composite Resins / Q000737:chemistry; D001840:Dental Bonding; D003743:Dental Enamel / Q000528:radiation effects* / Q000648:ultrastructure; D017220:Dentin-Bonding Agents / Q000737:chemistry*; D053844:Lasers, Solid-State; D008689:Methacrylates / Q000737:chemistry; D008855:Microscopy, Electron, Scanning; D019279:Resin Cements / Q000737:chemistry; D017655:Silicon Compounds / Q000737:chemistry; D013314:Stress, Mechanical; D013499:Surface Properties; D013718:Tensile Strength
C453842:AQ bond; D017554:Carbon Compounds, Inorganic; C112828:Clearfil AP-X; C505694:Clearfil S3 Bond; C438313:Clearfil SE Bond; D003188:Composite Resins; D017220:Dentin-Bonding Agents; C498353:G-Bond; C495852:Metafil C; D008689:Methacrylates; D019279:Resin Cements; D017655:Silicon Compounds; C501838:Solare; C022088:silicon carbide