Interchip link system using an optical wiring method.
A chip-scale optical link system is presented with a transmitter/receiver and optical wire link. The interchip link system consists of a metal optical bench, a printed circuit board module, a driver/receiver integrated circuit, a vertical cavity surface-emitting laser/photodiode array, and an optical wire link composed of plastic optical fibers (POFs). We have developed a downsized POF and an optical wiring method that allows on-site installation with a simple annealing as optical wiring technologies for achieving high-density optical interchip interconnection within such devices. Successful data transfer measurements are presented.
Cho
In-Kui
IK
Electronics and Telecommunications Research Institute, Daejeon, Korea. cho303@etri.re.kr
Ryu
Jin-Hwa
JH
Jeong
Myung-Yung
MY