title: Interchip link system using an optical wiring method.
abstract: A chip-scale optical link system is presented with a transmitter/receiver and optical wire link. The interchip link system consists of a metal optical bench, a printed circuit board module, a driver/receiver integrated circuit, a vertical cavity surface-emitting laser/photodiode array, and an optical wire link composed of plastic optical fibers (POFs). We have developed a downsized POF and an optical wiring method that allows on-site installation with a simple annealing as optical wiring technologies for achieving high-density optical interchip interconnection within such devices. Successful data transfer measurements are presented.
authors: Electronics and Telecommunications Research Institute, Daejeon, Korea. cho303@etri.re.kr
authors: In-Kui
authors: IK
authors: Cho
authors: Jin-Hwa
authors: JH
authors: Ryu
authors: Myung-Yung
authors: MY
authors: Jeong