Chip-to-chip optical interconnect using gold long-range surface plasmon polariton waveguides.
We demonstrate a novel on-board chip-to-chip optical interconnect using long-range surface plasmon polariton (LR-SPP) waveguides that feature 2.5-cm-long gold strips embedded in a low loss polymer cladding. A TM-mode vertical-cavity surface-emitting laser (VCSEL) operating at a wavelength of 1.3 microm was butt-coupled into the waveguides in order to excite a fundamental LR-SPP mode and then the transmitted light was received with a photo-diode (PD). The waveguide width is varied in the range of 1.5-5.0 microm in order to optimize the insertion loss where the 3-microm-wide waveguide provides a minimum insertion loss of -17 dB, consisting of 6 dB/cm propagation loss and 2 dB coupling loss. An interconnect system based on the optimized waveguide with a 4-channel array is assembled with the arrayed optoelectronic chips. It shows the feasibility of 10 Gbps (2.5 Gbps x 4 channels) signal transmission indicating that the LR-SPP waveguide is a potential transmission line for optical interconnection.
Kim
Jin Tae
JT
Convergence Components and Materials Research Laboratory, ETRI, Daejeon 305-700, Korea. jintae@etri.re.kr
Ju
Jung Jin
JJ
Park
Suntak
S
Kim
Min-su
MS
Park
Seung Koo
SK
Lee
Myung-Hyun
MH
D004867:Equipment Design; D019544:Equipment Failure Analysis; D006046:Gold / Q000737:chemistry*; D008027:Light; D055095:Optics and Photonics / Q000295:instrumentation*; D012542:Scattering, Radiation; D020349:Surface Plasmon Resonance / Q000295:instrumentation*
D006046:Gold