title: Manufacturing process of reproduction plate by nonmetallic materials reclaimed from pulverized printed circuit boards.
abstract: The aim of this study was to present a new method for resource utilization of nonmetallic materials reclaimed from pulverized waste printed circuit boards. A reproduction nonmetallic plate (RNMP) was prepared by adding resin paste, glass fiber and additives into nonmetallic materials using self-made hot-press former. Principle of manufacturing process and effects of mould temperature and moulding time on the mechanical properties of RNMP were studied. The results showed that when moulding pressure was fixed at 6 MPa, the optimum conditions for the RNMP were as follows: 140/135 degrees C for top/bottom mould temperature, 5 min for moulding time. The maximum content of nonmetallic materials in RNMP was up to 40 wt%. When nonmetallic material content was 20 wt%, the RNMP moulded at optimum conditions had excellent mechanical properties, with impact strength of 5.8 kJ/m(2) and flexural strength of 65.1 MPa.
authors.affiliation: School of Environmental Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240, PR China.
authors.forename: Jie
authors.initials: J
authors.lastname: Guo
authors.forename: Jiuyong
authors.initials: J
authors.lastname: Guo
authors.forename: Bin
authors.initials: B
authors.lastname: Cao
authors.forename: Yinen
authors.initials: Y
authors.lastname: Tang
authors.forename: Zhenming
authors.initials: Z
authors.lastname: Xu