Single-pulse ultrafast-laser machining of high aspect nano-holes at the surface of SiO2.
Use of high numerical aperture focusing with negative longitudinal spherical aberration is shown to enable deep (> microm), high aspect ratio, nano-scale-width holes to be machined into the surface of a fused-silica (SiO(2)) substrate with single pulses from a 200 fs, 4 microJ Ti-Sapphire laser source. The depths of the nano-holes are characterized by use of a non-destructive acetate replication technique and are confirmed by imaging of sectioned samples with a dual focused ion beam/scanning electron microscope.
White
Yelena V
YV
Department University of Tennessee Space Institute, Tullahoma, TN 37388, USA. ywhite@utsi.edu
Li
Xiaoxuan
X
Sikorski
Zbigniew
Z
Davis
Lloyd M
LM
Hofmeister
William
W
D007834:Lasers; D049329:Nanostructures / Q000737:chemistry* / Q000528:radiation effects / Q000648:ultrastructure*; D036103:Nanotechnology / Q000379:methods*; D016062:Porosity / Q000528:radiation effects; D011829:Radiation Dosage; D012822:Silicon Dioxide / Q000737:chemistry* / Q000528:radiation effects*
D012822:Silicon Dioxide