[Leaching behavior of heavy metal elements in lead-free solders].
Leaching behavior of heavy metal elements from Sn-3.5 Ag-0.5 Cu, Sn-3.5 Ag, Sn-0.5 Cu lead-free solders and their joints were investigated in typical acid, alkaline and saline corrosion solutions. It is found that for solder alloys, significant leaching of Sn was observed in NaCl saline solution, about two orders of magnitude higher than that in acid and alkaline solution. However, in the case of solder joints, more leaching of Sn was observed in acid solution from Sn-3.5 Ag/Cu and Sn-0.5 Cu/Cu joints, and in NaOH alkaline solution for Sn-3.5 Ag - 0.5 Cu joint.
State Key Laboratory of Materials Modification, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116023, China. jiezhao@dlut.edu.cn
Jie
J
Zhao
Xian-ming
XM
Meng
Chen
C
Chen
Hua-xun
HX
Zang
Hai-Tao
HT
Ma
D000497:Alloys / Q000032:analysis* / Q000737:chemistry; D004563:Electrochemistry; D004581:Electronics; D004784:Environmental Monitoring / Q000379:methods; D004787:Environmental Pollution / Q000517:prevention & control*; D007220:Industrial Waste / Q000032:analysis; D007854:Lead; D019216:Metals, Heavy / Q000032:analysis* / Q000737:chemistry
D000497:Alloys; D007220:Industrial Waste; D019216:Metals, Heavy; D007854:Lead