title: Large-area unmodified superhydrophobic copper substrate can be prepared by an electroless replacement deposition.
abstract: Using an electroless replacement deposition method, large-area superhydrophobic metal substrate could be obtained. The superhydrophobic surfaces were prepared via a replacement reaction between copper substrate and HAuCl(4) solution. The roughness of the copper substrate increased much after the replacement reaction. X-ray powder diffraction (XRD) pattern and energy dispersive X-ray (EDX) spectroscopy have proved that gold, CuCl and Cu(2)O formed on the surface of copper substrate after the replacement reaction. The surface showed remarkable superhydrophobic properties with a contact angle higher than 150 degrees without any modification with a self-assembled monolayer (SAM) of long chain thiol or perfluoro molecules.
authors.affiliation: Key Laboratory of Supramolecular Structure and Materials of Ministry of Education, Jilin University, 2699#, Qianjin Street, Changchun 130012, PR China.
authors.forename: Wei
authors.initials: W
authors.lastname: Song
authors.forename: Jianjun
authors.initials: J
authors.lastname: Zhang
authors.forename: Yunfei
authors.initials: Y
authors.lastname: Xie
authors.forename: Qian
authors.initials: Q
authors.lastname: Cong
authors.forename: Bing
authors.initials: B
authors.lastname: Zhao