Thermal stability of Cu and Cu2O nanoparticles in a polyimide film.
Nanoparticles of Cu or Cu oxide dispersed in a polyimide (PI) film were fabricated by reaction of polyamic acid with a thin Cu film during imidization. In this paper, the thermal stability of the Cu or Cu oxide nanoparticles was investigated under various atmospheres. The PI/nanoparticle composites were heat-treated at 140 degrees C and 250 degrees C in air, N2, Ar, and 5% H2 atmospheres. Nanoparticles in the PI film were characterized by UV-VIS spectroscopy and transmission electron microscopy. The optical absorption peaks originating from Cu or Cu2O nanoparticles were changed by heat-treatment in different atmospheres. When Cu nanoparticles were oxidized by heat-treatment in air, the surface plasmon resonance (SPR) peak originating from the Cu nanoparticles disappeared. The quantum confined absorption peak of Cu2O was not affected by heat-treatment in N2 or Ar. Cu2O nanoparticles were reduced by heat-treatment at 250 degrees C in 5% H2 atmosphere and a new SPR peak appeared. Our results show that Cu nanoparticles are easily oxidized and highly dense Cu nanoparticles can be formed by reducing Cu2O nanoparticles.
Choi
Jae-Youn
JY
Division of Materials Science and Engineering, Hanyang University, Seoul 133-791, Korea.
Dong
Wenguo
W
Choi
Dong Joo
DJ
Yoon
Chong S
CS
Kim
Young-Ho
YH