Extreme-ultraviolet microexposure tool at 0.5 NA for sub-16 nm lithography.
The resolution limit of present 0.3 NA 13.5 nm wavelength microexposure tools is compared to next-generation lithography research requirements. Findings suggest that a successor design is needed for patterning starting at the 16 nm semiconductor process technology node. A two-mirror 0.5 NA optical design is presented, and performance expectations are established from detailed optical and lithographic simulation. We report on the results from a SEMATECH program to fabricate a projection optic with an ultimate resolution limit of approximately 11 nm.
Goldstein
Michael
M
SEMATECH, Albany, NY 12203, USA. michael.goldstein@sematech.org
Hudyma
Russ
R
Naulleau
Patrick
P
Wurm
Stefan
S