title: Extreme-ultraviolet microexposure tool at 0.5 NA for sub-16 nm lithography.
abstract: The resolution limit of present 0.3 NA 13.5 nm wavelength microexposure tools is compared to next-generation lithography research requirements. Findings suggest that a successor design is needed for patterning starting at the 16 nm semiconductor process technology node. A two-mirror 0.5 NA optical design is presented, and performance expectations are established from detailed optical and lithographic simulation. We report on the results from a SEMATECH program to fabricate a projection optic with an ultimate resolution limit of approximately 11 nm.
authors.affiliation: SEMATECH, Albany, NY 12203, USA. michael.goldstein@sematech.org
authors.forename: Michael
authors.initials: M
authors.lastname: Goldstein
authors.forename: Russ
authors.initials: R
authors.lastname: Hudyma
authors.forename: Patrick
authors.initials: P
authors.lastname: Naulleau
authors.forename: Stefan
authors.initials: S
authors.lastname: Wurm