Interconnection technologies for laser-patterned electrode arrays.
Standard interconnection technologies are reviewed in respect to their applicability to electrically and mechanically connect laser-patterned nerve electrodes made from silicone rubber and platinum foil to wires and screen printed alumina substrates. Laser welding, gap welding, microflex ball bonding, and soldering are evaluated. Corresponding processes were established and evaluated in respect to their mechanical strength. Best results were obtained by soldering. If soldering cannot be used because of regulatory reasons, parallel gap welding and microflex are recommended. Laser welding provides weaker interconnects with only moderate reproducibility.
Schuettler
Martin
M
Laboratory for Biomedical Microtechnology, Department of Microsystems Engineering, University of Freiburg, Germany. schuettler@imtek.de
Henle
Christian
C
Ordonez
Juan S
JS
Meier
Wolfgang
W
Guenther
Thomas
T
Stieglitz
Thomas
T
D000535:Aluminum / Q000737:chemistry; D004566:Electrodes; D004583:Electrons; D004867:Equipment Design; D006801:Humans; D007834:Lasers; D008422:Materials Testing; D008855:Microscopy, Electron, Scanning; D009474:Neurons / Q000378:metabolism; D010984:Platinum / Q000737:chemistry; D012408:Rubber; D012825:Silicon / Q000737:chemistry; D013314:Stress, Mechanical; D013499:Surface Properties
D010984:Platinum; D012408:Rubber; D000535:Aluminum; D012825:Silicon