Does adhesive thickness affect resin-dentin bond strength after thermal/load cycling?
This study evaluated the influence of adhesive layer thickness (ADL) on the resin-dentin bond strength of two adhesive systems (AS) after thermal and mechanical loading (TML). A flat superficial dentin surface was exposed with 600-grit SiC paper on 40 molars. After primer application, the adhesive layer of Scotchbond Multipurpose (SBMP) or Clearfil SE Bond (CSEB) was applied in one or two layers to a delimited area (52 mm2) and resin blocks (Filtek Z250) were built incrementally. Half of the sample was stored in distilled water (37 degrees C, 24 hours) and submitted to thermal (1,000; 5 degrees -55 degrees C) and mechanical cycles (500,000; 10kgf) [TML]. The other half was stored in distilled water (72 hours). The teeth were then sectioned to obtain sticks (0.8 mm2) to be tested under tensile mode (1.0 mm/minute). The fracture mode was analyzed at 400x. The BS from all sticks from the same tooth was averaged for statistical purposes. The data was analyzed by three-way ANOVA. The chi2 test was used (p < 0.05) to compare the frequency of pre-testing failure specimens. Higher BS values were observed for SBMP regardless of the ADL. The TML reduced the BS values irrespective of the adhesive employed and the ADL. A higher frequency of pre-testing failure specimens was observed for the cycled groups. A thicker adhesive layer, acting as an intermediate flexible layer, did not minimize the damage caused by thermal/mechanical load cycling for a three-step etch-and-rinse and two-step self-etch system.
Lodovici
Edmea
E
Department of Biomaterials and Oral Biochemistry, School of Dentistry, University of São Paulo, São Paulo, Brazil.
Reis
Alessandra
A
Geraldeli
Saulo
S
Ferracane
Jack L
JL
Ballester
Rafael Yague
RY
Rodrigues Filho
Leonardo Eloy
LE
D000134:Acid Etching, Dental / Q000379:methods; D017554:Carbon Compounds, Inorganic / Q000737:chemistry; D003188:Composite Resins / Q000737:chemistry; D001840:Dental Bonding; D003764:Dental Materials / Q000737:chemistry; D003804:Dentin / Q000648:ultrastructure*; D017220:Dentin-Bonding Agents / Q000737:chemistry*; D006801:Humans; D008422:Materials Testing; D008855:Microscopy, Electron, Scanning; D018583:Pliability; D019279:Resin Cements / Q000737:chemistry; D017655:Silicon Compounds / Q000737:chemistry; D016369:Smear Layer; D013314:Stress, Mechanical; D013499:Surface Properties; D013696:Temperature; D013718:Tensile Strength; D014867:Water / Q000737:chemistry
D017554:Carbon Compounds, Inorganic; C438313:Clearfil SE Bond; D003188:Composite Resins; D003764:Dental Materials; D017220:Dentin-Bonding Agents; C444701:Filtek Z250; D019279:Resin Cements; C084018:Scotchbond Multi-Purpose; D017655:Silicon Compounds; D014867:Water; C022088:silicon carbide