title: Stamping-based planarization of flexible substrate for low-pressure UV nanoimprint lithography.
abstract: Patterning flexible substrates in nano scale is an important and challenging issue in the fabrication of next-generation devices based on a non-silicon substrate. Step and Flash imprint lithography (S-FIL) which is a room temperature and low pressure process offers several important advantages, such as the use of a smaller and therefore cheaper stamp or the possibility of the overlay imprinting, as a transparent stamp is utilized. However, it is very difficult to perform S-FIL on a flexible substrate successfully due to the high waviness. The waviness of a flexible substrate is not a constant value in contrast to a rigid substrate. It depends on the imprint pressure applied onto the substrate. In this paper, in section two, the effect of the imprint pressure on the waviness of the surface of the flexible substrate is examined. It is proved that the waviness of the surface of the flexible substrate could not be reduced sufficiently to assure a successful imprint at low imprint pressures. In the third section, a method of patterning polymer substrates using ultra-violet nanoimprint lithography (UV-NIL) is presented. The method consists of two stages, stamping-based planarization and S-FIL. In stamping-based planarization, a planarization layer of transparent polymer is formed onto the flexible substrate. Waviness of the blank stamp (in this study, glass wafer) is transferred to the planarization layer. S-FIL is performed with the nanoimprint tool IMPRIO100 directly onto the planarization layer employing a 1 x 1 in. quartz stamp. Optical microscope and SEM images of the successfully imprinted patterns were also presented.
authors.affiliation: Nano-Mechanical Systems Research Center, Korea Institute of Machinery and Materials, 171 Jang-dong, Yuseong-gu, Daejeon 305-343, Korea.
authors.forename: Ali Ozhan
authors.initials: AO
authors.lastname: Altun
authors.forename: Jun-Ho
authors.initials: JH
authors.lastname: Jeong
authors.forename: Sung-Un
authors.initials: SU
authors.lastname: Jung
authors.forename: Ki-Don
authors.initials: KD
authors.lastname: Kim
authors.forename: Dae-Geun
authors.initials: DG
authors.lastname: Choi
authors.forename: Jun-Hyuk
authors.initials: JH
authors.lastname: Choi
authors.forename: Jong-Youp
authors.initials: JY
authors.lastname: Shim
authors.forename: Dong-Il
authors.initials: DI
authors.lastname: Lee
authors.forename: Eung-Sug
authors.initials: ES
authors.lastname: Lee
mesh_terms: D003460:Crystallization / Q000379:methods*; D055119:Elastic Modulus / Q000528:radiation effects; D046911:Macromolecular Substances / Q000737:chemistry / Q000528:radiation effects; D008422:Materials Testing; D008968:Molecular Conformation / Q000528:radiation effects; D049329:Nanostructures / Q000737:chemistry* / Q000528:radiation effects / Q000648:ultrastructure*; D036103:Nanotechnology / Q000379:methods*; D010316:Particle Size; D011108:Polymers / Q000737:chemistry* / Q000528:radiation effects; D011312:Pressure; D013499:Surface Properties / Q000528:radiation effects; D014466:Ultraviolet Rays
chemical_list: D046911:Macromolecular Substances; D011108:Polymers