Joining and interconnect formation of nanowires and carbon nanotubes for nanoelectronics and nanosystems.
Interconnect formation is critical for the assembly and integration of nanocomponents to enable nanoelectronics- and nanosystems-related applications. Recent progress on joining and interconnect formation of key nanomaterials, especially nanowires and carbon nanotubes, into functional circuits and/or prototype devices is reviewed. The nanosoldering technique through nanoscale lead-free solders is discussed in more detail in this Review. Various strategies of fabricating lead-free nanosolders and the utilization of the nanosoldering technique to form functional solder joints are reviewed, and related challenges facing the nanosoldering technique are discussed. A perspective is given for using lead-free nanosolders and the nanosoldering technique for the construction of complex and/or hybrid nanoelectronics and nanosystems.
Cui
Qingzhou
Q
Department of Chemical Engineering and CHN/NCOE Nanomanufacturing Center One University Ave. University of Massachusetts Lowell Lowell, MA 01854, USA.
Gao
Fan
F
Mukherjee
Subhadeep
S
Gu
Zhiyong
Z
D036103:Nanotechnology / Q000379:methods*; D037742:Nanotubes, Carbon / Q000737:chemistry*; D053770:Nanowires / Q000737:chemistry*
D037742:Nanotubes, Carbon