title: Joining and interconnect formation of nanowires and carbon nanotubes for nanoelectronics and nanosystems.
abstract: Interconnect formation is critical for the assembly and integration of nanocomponents to enable nanoelectronics- and nanosystems-related applications. Recent progress on joining and interconnect formation of key nanomaterials, especially nanowires and carbon nanotubes, into functional circuits and/or prototype devices is reviewed. The nanosoldering technique through nanoscale lead-free solders is discussed in more detail in this Review. Various strategies of fabricating lead-free nanosolders and the utilization of the nanosoldering technique to form functional solder joints are reviewed, and related challenges facing the nanosoldering technique are discussed. A perspective is given for using lead-free nanosolders and the nanosoldering technique for the construction of complex and/or hybrid nanoelectronics and nanosystems.
authors.affiliation: Department of Chemical Engineering and CHN/NCOE Nanomanufacturing Center One University Ave. University of Massachusetts Lowell Lowell, MA 01854, USA.
authors.forename: Qingzhou
authors.initials: Q
authors.lastname: Cui
authors.forename: Fan
authors.initials: F
authors.lastname: Gao
authors.forename: Subhadeep
authors.initials: S
authors.lastname: Mukherjee
authors.forename: Zhiyong
authors.initials: Z
authors.lastname: Gu
mesh_terms: D036103:Nanotechnology / Q000379:methods*; D037742:Nanotubes, Carbon / Q000737:chemistry*; D053770:Nanowires / Q000737:chemistry*
chemical_list: D037742:Nanotubes, Carbon