The fabrication of embedded co-planar electrodes using a self-assembled monolayer molecular resist.
We demonstrate a new process for fabricating embedded co-planar electrodes which combines top-down with bottom-up approaches to nanofabrication. The co-planarity of the electrodes with the substrate surface is achieved by deposition of a dielectric filling layer around a set of lithographically defined metallic electrodes. In order to prevent adhesion of the dielectric to the pre-defined electrodes, an adhesion inhibiting layer, based on a self-assembled monolayer, is formed specifically on the electrode surface prior to deposition of the dielectric. For monolayers with an acid functional group, this adhesion inhibitor yields almost complete non-adhesion of the dielectric filling layer.
Johnson
Steven
S
School of Electronic and Electrical Engineering, University of Leeds, Leeds LS2 9JT, UK.
Evans
David
D
Davies
A Giles
AG
Linfield
Edmund H
EH
Wälti
Christoph
C