Thermoplastic polymer patterning without residual layer by advanced nanoimprinting schemes.
Nanoimprinting is a fast-growing technique for nanoscale patterning. One of the remaining issues in nanoimprinting is the removal of the residual layer after nanoimprinting. Traditionally the residual layer is removed by an oxygen reactive-ion etching (RIE) step. The need for a vacuum environment and dedicated equipment in this step lowers the throughput and increases the cost of the nanoimprinting process. It also prevents the possibility of patterning isolated functional polymers because oxygen RIE destroys the functional materials. In this work, novel nanoimprinting schemes are developed to nondestructively remove the residual layer in thermal nanoimprinting by solvent developing and dewetting. Combined with a transfer-bonding technique, three-dimensional polymer scaffolds are achieved. The techniques developed here eliminate the RIE step in thermal nanoimprinting and are compatible with roller nanoimprinting for large-scale patterning of polymer micro- or nanostructures. The technique also opens up new applications for nanoimprinting in patterning isolated conjugated polymers for organic electronic devices and circuits.
Park
Hyunsoo
H
Solid-State Electronics, Photonics and Nano-Engineering Laboratory, Department of Electrical and Computer Engineering, Texas A&M University, College Station, TX 77843-3128, USA.
Cheng
Xing
X
D003460:Crystallization / Q000379:methods*; D006358:Hot Temperature; D046911:Macromolecular Substances / Q000737:chemistry; D008422:Materials Testing; D008968:Molecular Conformation; D049329:Nanostructures / Q000737:chemistry* / Q000648:ultrastructure*; D036103:Nanotechnology / Q000379:methods*; D010316:Particle Size; D011108:Polymers / Q000737:chemistry*; D013499:Surface Properties
D046911:Macromolecular Substances; D011108:Polymers