MEMS within a Swagelok: a new platform for microfluidic devices.
A novel packaging cum interfacing technique for microfluidic devices is reported. Unlike the conventional approach towards packaging in which the microsystem is first developed and finally packaged, a reverse approach is shown here that integrates the package with the microsystem either at the beginning or within the fabrication process. This new method employs standard glass tubes as substrates on which microfluidic components are fabricated. The tubular-substrate directly translates into a package and an interface, leading to 'plug-n-play' devices. Due to this approach, external handling forces on the microfluidic system are redirected towards the strong glass tube, and thus, improves device robustness. Maintaining the total size of the microsystem within the circumference of the glass tube enables this MEMS-on-tube assembly to be encapsulated within standard Swagelok connectors.
Unnikrishnan
Sandeep
S
Transducer Science and Technology group, MESA+ Institute for Nanotechnology, University of Twente, PO box 217, 7500 AE, Enschede, The Netherlands. s.unnikrishnan@ewi.utwente.nl
Jansen
Henri
H
Berenschot
Erwin
E
Mogulkoc
Berker
B
Elwenspoek
Miko
M