45 degree polymer micromirror integration for board-level three-dimensional optical interconnects.
We introduce here a simple method of integrating 45 degrees total internal reflection micro-mirrors with polymer optical waveguides by an improved tilted beam photolithography on printed circuit boards to provide surface normal light coupling between waveguides and optoelectronic devices for optical interconnects. De-ionized water is used to couple ultraviolet beam through the waveguide core polymer layer at 45 degrees angle during the photo exposure process. This technique is compatible with PCB manufacturing facility and suitable to large panel board-level manufacturing. The mirror slope is controlled accurately (within +/- 1 degrees) with high repeatability. The insertion loss of an uncoated micro-mirror is measured to be 1.6 dB.
Wang
Fengtao
F
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA. wangft@ece.gatech.edu
Liu
Fuhan
F
Adibi
Ali
A