title: Shaped silicon wafers obtained by hot plastic deformation: performance evaluation for future astronomical x-ray telescopes.
abstract: In order to develop lightweight and high angular resolution x-ray mirrors, we have investigated hot plastic deformation of 4 in. silicon (111) wafers. A sample wafer was deformed using hemispherical dies with a curvature radius of 1000 mm. The measured radius of the deformed wafer was 1030 mm, suggesting that further conditioning is indispensable for better shaping. For the first time to our knowledge, x-ray reflection on a deformed wafer was detected at Al K(alpha) 1.49 keV. An estimated surface roughness of <1 nm from the x-ray reflection profile was comparable to that of a bare silicon wafer without deformation. Hence, no significant degradation of the microroughness was seen.
authors: Department of Physics, Tokyo Metropolitan University, 1-1 Minami-Osawa, Hachioji, Tokyo 192-0397, Japan. ezoe@phys.metro-u.ac.jp
authors: Yuichiro
authors: Y
authors: Ezoe
authors: Takayuki
authors: T
authors: Shirata
authors: Ikuyuki
authors: I
authors: Mitsuishi
authors: Manabu
authors: M
authors: Ishida
authors: Kazuhisa
authors: K
authors: Mitsuda
authors: Kohei
authors: K
authors: Morishita
authors: Kazuo
authors: K
authors: Nakajima