title: Convective assembly and dry transfer of nanoparticles using hydrophobic/hydrophilic monolayer templates.
abstract: A convective directed-assembly process on a flat substrate that does not require motion and is followed by a dry-transfer process of nanoparticles is presented. The convective assembly process was achieved using Au nanoparticles on hydrophobic/hydrophilic-surface-patterned Si substrates as functions of temperature, gap height, and particle size. An investigation of the particle assembly mechanism showed that the effects of temperature, gap height, and particle size were responsible for controlling the evaporation time, the evaporation length, and the assembly speed, respectively. To ensure conformal contact during the dry-transfer process, chemically patterned hybrid templates with elastic and flexible properties were fabricated and used. The hybrid templates provided conformal contact with a target silicon substrate coated with MPTMS (3-mercaptopropyltrimethoxysilane) and successfully transferred Au particles to the target substrates.
authors.affiliation: NSF Nanoscale Science and Engineering Center for High-Rate Nanomanufacturing, Northeastern University, Boston, Massachusetts 02115, USA.
authors.forename: Nam-Goo
authors.initials: NG
authors.lastname: Cha
authors.forename: Yolanda
authors.initials: Y
authors.lastname: Echegoyen
authors.forename: Tae-Hoon
authors.initials: TH
authors.lastname: Kim
authors.forename: Jin-Goo
authors.initials: JG
authors.lastname: Park
authors.forename: Ahmed A
authors.initials: AA
authors.lastname: Busnaina
mesh_terms: D006046:Gold / Q000737:chemistry; D057927:Hydrophobic and Hydrophilic Interactions; D053768:Metal Nanoparticles / Q000737:chemistry*; D008855:Microscopy, Electron, Scanning; D010316:Particle Size; D012825:Silicon / Q000737:chemistry; D013696:Temperature
chemical_list: D006046:Gold; D012825:Silicon