title: Capacitive micromachined ultrasonic transducers using commercial multi-user MUMPs process: capability and limitations.
abstract: The objective of this work is to construct capacitive micromachined ultrasound transducers (cMUTs) using multi-user microelectromechanical systems (MEMS) processess (MUMPs) and to analyze the capability of this process relative to the customized processes commonly in use. The MUMPs process has the advantages of low cost and accessibility to general users since it is not necessary to have access to customized fabrication capability such as wafer-bonding and sacrificial release processes. While other researchers have reported fabricating cMUTs using the MUMPs process none has reported the limitations in the process that arise due to the use of standard design rules that place limitations on the material thicknesses, gap thicknesses, and materials that may be used. In this paper we explain these limitations, and analyze the capabilities using 1D modeling, Finite Element Analysis, and experimental devices. We show that one of the limitations is that collapse voltage and center frequency can not be controlled independently. However, center frequencies up to 9 MHz can be achieved with collapse voltages of less than 200 V making such devices suitable for medical and non-destructive evaluation imaging applications. Since the membrane and base electrodes are made of polysilicon, there is a larger series resistance than that resulting from processes that use metal electrodes. We show that the series resistance is not a significant problem. The conductive polysilicon can also destroy the cMUT if the top membrane is pulled in the bottom. As a solution we propose the application of an additional dielectric layer. Finally we demonstrate a device built with a novel beam construction that produces transmitted pressure pulse into air with 6% bandwidth and agrees reasonably well with the 1D model. We conclude that cMUTs made with MUMPs process have some limitations that are not present in customized processes. However, these limitations may be overcome with the proper design considerations that we have presented putting a low cost, highly accessible means of making cMUT devices into the hands of academic and industrial researchers.
authors.affiliation: Department of Mechanical Engineering, University of Colorado at Boulder, Boulder, CO, USA.
authors.forename: Jessica
authors.initials: J
authors.lastname: Liu
authors.forename: Clyde
authors.initials: C
authors.lastname: Oakley
authors.forename: Robin
authors.initials: R
authors.lastname: Shandas
mesh_terms: D017076:Computer-Aided Design; D025802:Electric Capacitance; D004867:Equipment Design; D019544:Equipment Failure Analysis; D007089:Image Enhancement / Q000295:instrumentation*; D055617:Micro-Electrical-Mechanical Systems / Q000295:instrumentation*; D008904:Miniaturization; D015203:Reproducibility of Results; D012680:Sensitivity and Specificity; D014159:Transducers; D014463:Ultrasonography / Q000295:instrumentation*